Methods and Systems for Water Jet Assisted CMP Processing

Abstract

Methods and systems for removing dirt and/or debris from a CMP pad surface during CMP pad processing are provided. In one aspect, a method for removing debris from a CMP pad surface during CMP processing can include rotating a CMP pad having a polishing surface, and pressing a CMP pad dresser into the polishing surface of the CMP pad, the CMP pad dresser having a plurality of superabrasive particles coupled thereto and oriented toward the CMP pad. The method can further include spraying a jet of liquid onto the polishing surface of the CMP pad with sufficient force to dislodge debris from the polishing surface of the CMP pad.

1 . A method for removing debris from a CMP pad surface during CMP processing, comprising:
 rotating a CMP pad having a polishing surface;   pressing a CMP pad dresser into the polishing surface of the CMP pad, the CMP pad dresser having a plurality of superabrasive particles coupled thereto and oriented toward the CMP pad; and   spraying a jet of liquid onto the polishing surface of the CMP pad with sufficient force to dislodge debris from the polishing surface of the CMP pad.   
     
     
         2 . The method of  claim 1 , wherein the liquid is water. 
     
     
         3 . The method of  claim 1 , wherein the liquid contains abrasive particles. 
     
     
         4 . The method of  claim 1 , wherein the jet of liquid is sprayed onto an area of the polishing surface of the CMP pad adjacent to the CMP pad dresser. 
     
     
         5 . The method of  claim 4 , wherein the jet of liquid is sprayed onto an area of the polishing surface of the CMP pad that is adjacent to a leading edge of the CMP pad dresser. 
     
     
         6 . The method of  claim 4 , wherein the jet of liquid is sprayed onto an area of the polishing surface of the CMP pad that is adjacent to a trailing edge of the CMP pad dresser. 
     
     
         7 . The method of  claim 1 , wherein the jet of liquid is sprayed through an opening in the CMP pad dresser to contact an area of the polishing surface within a circumferential area of the CMP pad dresser. 
     
     
         8 . The method of  claim 7 , wherein the CMP pad dresser is an annular ring and the jet of liquid is sprayed onto the polishing surface through an open center portion of the annular ring. 
     
     
         9 . The method of  claim 1 , wherein spraying the jet of liquid onto the polishing surface further includes spraying the jet of liquid in a pulsatile pattern. 
     
     
         10 . A system for performing CMP processing, comprising:
 a CMP pad coupled to a support surface operable to rotate the CMP pad, the CMP pad having a polishing surface opposite to the support surface;   a CMP pad dresser having a plurality of superabrasive particles coupled thereto and oriented toward the CMP pad, the CMP pad dresser being oriented orthogonally with respect to the support surface and operable to press the plurality of superabrasive particles into the CMP pad; and   a liquid jetting system positioned and operable to spray a liquid onto the polishing surface of the CMP pad with sufficient force to dislodge debris from the polishing surface.   
     
     
         11 . The system of  claim 10 , wherein the liquid jetting system is positioned and operable to spray the liquid onto an area of the polishing surface that is adjacent to the CMP pad dresser. 
     
     
         12 . The system of  claim 10 , wherein the liquid jetting system is positioned and operable to spray the liquid onto an area of the polishing surface that is adjacent to a leading edge of the CMP pad dresser. 
     
     
         13 . The system of  claim 10 , wherein the liquid jetting system is positioned and operable to spray the liquid onto an area of the polishing surface that is adjacent to a trailing edge of the CMP pad dresser. 
     
     
         14 . The system of  claim 10 , wherein the CMP pad dresser includes an open portion, wherein the liquid jetting system is positioned and operable to spray the liquid through the open portion of the CMP pad dresser and onto an area of the polishing surface. 
     
     
         15 . The system of  claim 14 , wherein the CMP pad dresser is an annular ring and the liquid jetting system is positioned and operable to spray the liquid onto the area of the polishing surface through an open center portion of the annular ring. 
     
     
         16 . The system of  claim 10 , wherein the liquid jetting system is operable to spray the liquid in a linear pattern adjacent a leading edge of the CMP pad dresser. 
     
     
         17 . The system of  claim 10 , wherein the liquid jetting system is operable to spray the liquid in a linear pattern adjacent a trailing edge of the CMP pad dresser. 
     
     
         18 . The system of  claim 17 , wherein the linear pattern is oriented at an angle with respect to a radius of the CMP pad such that debris dislodged from the polishing surface is channeled toward an edge of the CMP pad by the linear pattern of the liquid. 
     
     
         19 . The system of  claim 10 , further comprising a suction system positioned and operable to remove loosened debris from the polishing surface of the CMP pad. 
     
     
         20 . A method for removing debris from a CMP pad surface following CMP processing, comprising:
 conditioning a polishing surface of a CMP pad using a CMP pad dresser; and   spraying a jet of liquid onto the polishing surface of the CMP pad with sufficient force to dislodge debris from the polishing surface of the CMP pad.