US2010282444A1PendingUtilityA1

Heat-dissipating fin assembly with heat-conducting structure

Assignee: LIN KUO-LENPriority: May 5, 2009Filed: Jul 30, 2009Published: Nov 11, 2010
Est. expiryMay 5, 2029(~2.8 yrs left)· nominal 20-yr term from priority
H10W 40/226H10W 40/73H10W 40/43F28D 15/0275F28F 1/325
45
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

The present invention relates to a heat-dissipating fin capable of increasing surface turbulence, which includes a first heat-dissipating fin and a second heat-dissipating fin. A first surface of the first heat-dissipating fin is provided with a plurality of first protrusions arranged at intervals. The second heat-dissipating fin has a second surface toward the first surface. The second surface is also provided with a plurality of second protrusions arranged at intervals. The second protrusions are arranged to correspond to the first protrusions. The second heat-dissipating fin is overlapped with the first heat-dissipating fin. With the arrangement of the first protrusions and the second protrusions, the heat-dissipating area of the first heat-dissipating fin and the second heat-dissipating fin can be increased so as to increase the surface turbulence. Thus, the heat-exchange efficiency can be enhanced.

Claims

exact text as granted — not AI-modified
1 . A heat-dissipating fin assembly, comprising:
 a first heat-dissipating fin having a first surface, the first surface being provided with a plurality of first protrusions arranged at intervals;   a second heat-dissipating fin overlapped with the first heat-dissipating fin and having a second surface toward the first surface, the second surface being provided with a plurality of second protrusions arranged at intervals, the second protrusions being arranged to correspond to the first protrusions.   
     
     
         2 . The heat-dissipating fin assembly according to  claim 1 , wherein the first heat-dissipating fin is provided with a through-hole for allowing a heat pipe to penetrate therein. 
     
     
         3 . The heat-dissipating fin assembly according to  claim 2 , wherein the first heat-dissipating fin is provided with first flange at a periphery of the through-hole. 
     
     
         4 . The heat-dissipating fin assembly according to  claim 2 , wherein the first heat-dissipating fin is provided with a plurality of other first protrusions, the first protrusions and the other first protrusions are provided on both sides of the through-hole respectively. 
     
     
         5 . The heat-dissipating fin assembly according to  claim 1 , wherein each of two opposite sides of the first heat-dissipating fin is bent toward the same direction to form a first bending piece, thereby forming a gap when the first heat-dissipating fin is overlapped with the second heat-dissipating fin. 
     
     
         6 . The heat-dissipating fin assembly according to  claim 5 , wherein the height of the first bending piece is larger than that of the first protrusion. 
     
     
         7 . The heat-dissipating fin assembly according to  claim 5 , wherein an another side of the first heat-dissipating fin that is perpendicular to the first bending piece is provided with two first air-guiding pieces, and the two first air-guiding pieces are inclined reversely with respect to the first surface. 
     
     
         8 . The heat-dissipating fin assembly according to  claim 1 , wherein an another surface of the first heat-dissipating fin opposite to the first surface is provided with a plurality of first protrusions, and the first protrusions on the another surface are staggered with respect to the first protrusions on the first surface. 
     
     
         9 . The heat-dissipating fin assembly according to  claim 1 , wherein the second heat-dissipating fin is provided with a through-hole for allowing a heat pipe to penetrate therein. 
     
     
         10 . The heat-dissipating fin assembly according to  claim 9 , wherein the second heat-dissipating fin is provided with a second flange at the periphery of the through-hole to increase the contact area between the second heat-dissipating fin and the heat pipe. 
     
     
         11 . The heat-dissipating fin assembly according to  claim 10 , wherein the second heat-dissipating fin is provided with a plurality of other second protrusions, the second protrusions and the other second protrusions are provided on both sides of the through-hole respectively. 
     
     
         12 . The heat-dissipating fin assembly according to  claim 1 , wherein two opposite sides of the second heat-dissipating fin are bent toward the same side to form a second bending piece, thereby forming a gap when the second heat-dissipating fin is overlapped with the first heat-dissipating fin. 
     
     
         13 . The heat-dissipating fin assembly according to  claim 12 , wherein the height of the second bending piece is larger than that of the second protrusion. 
     
     
         14 . The heat-dissipating fin assembly according to  claim 12 , wherein the other side of the second heat-dissipating fin that is perpendicular to the second bending piece is provided with two second air-guiding pieces, the two air-guiding pieces are inclined reversely with respect to the second surface. 
     
     
         15 . The heat-dissipating fin assembly according to  claim 1 , wherein the other surface of the second heat-dissipating fin opposite to the second surface is also provided with a plurality of other second protrusions, the second protrusions on the other surface are staggered with respect to the second protrusions on the second surface. 
     
     
         16 . The heat-dissipating fin assembly according to  claim 1 , wherein each of the first protrusion and the second protrusion is a rib, the first protrusions and the second protrusions are arranged at intervals and parallel to each other obliquely, the second protrusions are inclined in a direction opposite to that of the first protrusions. 
     
     
         17 . The heat-dissipating fin assembly according to  claim 1 , wherein each of the first protrusion and the second protrusion is a semi sphere. 
     
     
         18 . The heat-dissipating fin assembly according to  claim 1 , wherein the first protrusion and the second protrusion are brought into contact with each other.

Join the waitlist — get patent alerts

Track US2010282444A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.