US2010270637A1PendingUtilityA1

Solid-state imagining device

Assignee: PANASONIC CORPPriority: Jul 4, 2007Filed: Jul 12, 2010Published: Oct 28, 2010
Est. expiryJul 4, 2027(~0.9 yrs left)· nominal 20-yr term from priority
H10F 39/8057H10F 39/811H10F 39/8063
58
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A solid-state imaging device includes: an imaging area in which light receiving portions are disposed; an interconnect layer disposed on the light receiving portions, the interconnect layer including metal interconnects having openings and first insulating films; inner-layer lenses formed over the interconnect layer in one-to-one relationship with the light receiving portions; a transparent second insulating film formed on the interconnect layer and the inner-layer lenses; top lenses formed on the second insulating film in one-to-one relationship with the light receiving portions, an upper face of each of the top lenses being a convexly curved face; and a transparent film on the top lenses, the transparent film being formed of a material having a refractive index smaller than a refractive index of the top lenses. In this way, a focal point of at least part of incident light can be situated above a semiconductor substrate.

Claims

exact text as granted — not AI-modified
1 - 15 . (canceled) 
     
     
         16 . A solid-state imaging device comprising:
 an imaging area including a plurality of light receiving portions formed on a semiconductor substrate;   a multi-layered interconnect layer disposed on the plurality of light receiving portions, the multi-layered interconnect layer including metal interconnects and insulating films; and   first lenses formed on the multi-layered interconnect layer in one-to-one relationship with the light receiving portions, wherein   the plurality of light receiving portions and the first lenses disposed two-dimensionally in a vertical direction and a horizontal direction in the imaging area,   the first lenses adjacent to each other in the horizontal direction are in connection with each other, and   the first lenses adjacent to each other in the diagonal direction are separated from each other.   
     
     
         17 . The solid-state imaging device of  claim 16 , wherein
 the first lenses in the vertical direction are in connection with each other.   
     
     
         18 . The solid-state imaging device of  claim 16 , wherein
 the curvature of the first lenses in the horizontal direction is smaller that the curvature of the first lenses in the diagonal direction.   
     
     
         19 . The solid-state imaging device of  claim 16 , further comprising a transparent film formed on the transparent film. 
     
     
         20 . The solid-state imaging device of  claim 19 , wherein
 the refractive index of the transparent film is not less than 1.4 and less than 1.5   
     
     
         21 . The solid-state imaging device of  claim 16 , wherein the thickness of the first lenses is not less than 0.5 μm and not more than 1.0 μm.

Join the waitlist — get patent alerts

Track US2010270637A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.