Solid-state imagining device
Abstract
A solid-state imaging device includes: an imaging area in which light receiving portions are disposed; an interconnect layer disposed on the light receiving portions, the interconnect layer including metal interconnects having openings and first insulating films; inner-layer lenses formed over the interconnect layer in one-to-one relationship with the light receiving portions; a transparent second insulating film formed on the interconnect layer and the inner-layer lenses; top lenses formed on the second insulating film in one-to-one relationship with the light receiving portions, an upper face of each of the top lenses being a convexly curved face; and a transparent film on the top lenses, the transparent film being formed of a material having a refractive index smaller than a refractive index of the top lenses. In this way, a focal point of at least part of incident light can be situated above a semiconductor substrate.
Claims
exact text as granted — not AI-modified1 - 15 . (canceled)
16 . A solid-state imaging device comprising:
an imaging area including a plurality of light receiving portions formed on a semiconductor substrate; a multi-layered interconnect layer disposed on the plurality of light receiving portions, the multi-layered interconnect layer including metal interconnects and insulating films; and first lenses formed on the multi-layered interconnect layer in one-to-one relationship with the light receiving portions, wherein the plurality of light receiving portions and the first lenses disposed two-dimensionally in a vertical direction and a horizontal direction in the imaging area, the first lenses adjacent to each other in the horizontal direction are in connection with each other, and the first lenses adjacent to each other in the diagonal direction are separated from each other.
17 . The solid-state imaging device of claim 16 , wherein
the first lenses in the vertical direction are in connection with each other.
18 . The solid-state imaging device of claim 16 , wherein
the curvature of the first lenses in the horizontal direction is smaller that the curvature of the first lenses in the diagonal direction.
19 . The solid-state imaging device of claim 16 , further comprising a transparent film formed on the transparent film.
20 . The solid-state imaging device of claim 19 , wherein
the refractive index of the transparent film is not less than 1.4 and less than 1.5
21 . The solid-state imaging device of claim 16 , wherein the thickness of the first lenses is not less than 0.5 μm and not more than 1.0 μm.Join the waitlist — get patent alerts
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