Computer enclosure

Abstract

A computer enclosure includes a side plate, an absorber plate, a heat-dissipating plate, and a number of heat pipes. The absorber plate is mounted on an inner wall of the side plate to absorb heat generated in the computer enclosure. The heat-dissipating plate is mounted on an outer wall of the side plate. The number of heat pipes is passed through the side plate to connect the absorber plate and the heat-dissipating plate, to transfer heat from the absorber plate to the heat-dissipating plate.

1 . A computer enclosure, comprising:
 a side plate;   an absorber plate mounted on an inner wall of the side plate, operable to absorb heat generated in the computer enclosure;   a heat-dissipating plate mounted on an outer wall of the side plate; and   a plurality of heat pipes passing through the side plate to connect the absorber plate and the heat-dissipating plate, operable to transfer heat from the absorber plate to the heat-dissipating plate.   
     
     
         2 . The computer enclosure of  claim 1 , wherein a plurality of parallel wavy grooves is defined in a surface of the absorber plate opposite to the side plate. 
     
     
         3 . The computer enclosure of  claim 1 , wherein the absorber plate is rectangular. 
     
     
         4 . The computer enclosure of  claim 1 , wherein a raised portion is mounted to a surface of the heat-dissipating plate opposite to the side plate. 
     
     
         5 . The computer enclosure of  claim 1 , wherein the heat-dissipating plate is rectangular. 
     
     
         6 . The computer enclosure of  claim 1 , wherein a plurality of through holes is defined in the side plate.