Microstructure

Abstract

Disclosed is a microfine structure which can be used as an anisotropic conductive member. Also disclosed is a method for producing such a microfine structure. Specifically disclosed is a microfine structure which is composed of a base having penetrating micropores at a density of not less than 10,000,000 micropores/mm 2 . In this microfine structure, some penetrating micropores are filled with a substance other than the material of the base.

1 - 15 . (canceled) 
     
     
         16 . A method of manufacturing a microstructure comprising a base having through micropores at a density of at least 10 7  micropores/mm 2 , part of the through micropores being filled with other material than a material of the base,
 wherein an aluminum substrate is subjected at least to, in order,   a treatment (A) for anodizing the aluminum substrate to form an oxide film having micropores;   a treatment (B) for removing aluminum from the oxide film obtained by the treatment (A);   a treatment (C) for perforating part of the micropores present in the oxide film from which the aluminum was removed by the treatment (B);   a treatment (D) for filling the part of the micropores that were perforated by the treatment (C) with a different material from an oxide film material; and   a step (E) of surface planarization for removing bottoms of micropores of the oxide film that were not perforated in the treatment (C) to make the unperforated micropores extend through the oxide film.   
     
     
         17 . The microstructure manufacturing method according to  claim 16 , wherein, in order to perforate the part of the micropores present in the oxide film in the treatment (C), the treatment (C) comprises at least a treatment (C′) which comprises:
 forming a pattern which is insoluble or hardly soluble in an acid or an alkali on a surface of the oxide film after removal of the aluminum; and   dissolving portions other than the pattern in the oxide film by using the acid or the alkali to make the micropores formed in the portions other than the pattern in the oxide film extend through the oxide film.   
     
     
         18 . The microstructure manufacturing method according to  claim 17 , wherein the treatment (C′) comprises at least a treatment (C′-1) which comprises:
 forming a photosensitive layer in which solubility with respect to the acid or the alkali changes in response to light on the surface of the oxide film after the removal of the aluminum;   irradiating the photosensitive layer with light beams; and   dissolving the photosensitive layer by using the acid or the alkali to form the pattern which is insoluble or hardly soluble in the acid or the alkali on the surface of the oxide film after the removal of the aluminum.   
     
     
         19 . The microstructure manufacturing method according to  claim 17 , wherein the treatment (C′) comprises at least a treatment (C′-2) which comprises:
 forming a thermosensitive layer in which solubility with respect to the acid or the alkali changes in response to heat on the surface of the oxide film after the removal of the aluminum;   heating the thermosensitive layer; and   dissolving the thermosensitive layer by using the acid or the alkali to form the pattern which is insoluble or hardly soluble in the acid or the alkali on the surface of the oxide film after the removal of the aluminum.   
     
     
         20 . The microstructure manufacturing method according to  16 , wherein, in the treatment (D), the different material from the oxide film material filled into the micropores that were made to extend through the oxide film by the treatment (C) is an electrically conductive material. 
     
     
         21 . The microstructure manufacturing method according to  17 , wherein, in the treatment (D), the different material from the oxide film material filled into the micropores that were made to extend through the oxide film by the treatment (C) is an electrically conductive material. 
     
     
         22 . The microstructure manufacturing method according to  18 , wherein, in the treatment (D), the different material from the oxide film material filled into the micropores that were made to extend through the oxide film by the treatment (C) is an electrically conductive material. 
     
     
         23 . The microstructure manufacturing method according to  19 , wherein, in the treatment (D), the different material from the oxide film material filled into the micropores that were made to extend through the oxide film by the treatment (C) is an electrically conductive material. 
     
     
         24 . The microstructure manufacturing method according to  claim 20 , wherein, in the treatment (D), the micropores that were made to extend through the oxide film by the treatment (C) are filled with the electrically conductive material by electrolytic plating. 
     
     
         25 . The microstructure manufacturing method according to  claim 21 , wherein, in the treatment (D), the micropores that were made to extend through the oxide film by the treatment (C) are filled with the electrically conductive material by electrolytic plating. 
     
     
         26 . The microstructure manufacturing method according to  claim 22 , wherein, in the treatment (D), the micropores that were made to extend through the oxide film by the treatment (C) are filled with the electrically conductive material by electrolytic plating. 
     
     
         27 . The microstructure manufacturing method according to  claim 23 , wherein, in the treatment (D), the micropores that were made to extend through the oxide film by the treatment (C) are filled with the electrically conductive material by electrolytic plating.