Acoustic cooling muffler for computing systems

Abstract

An acoustic cooling apparatus for a computing system, includes a cooling muffler comprising sidewalls and an endwall, the sidewalls being substantially parallel to each other, each sidewall being substantially perpendicular to the endwall at one end, the walls forming an enclosure having an open end opposing the endwall. Each sidewall includes an exhaust opening. At least a portion of the interior of each wall of the enclosure being covered by sound absorbing material for attenuating air cooling sound.

1 . An acoustic cooling apparatus for a computing system, comprising:
 a cooling muffler comprising sidewalls, a bottom wall and an endwall, the sidewalls being substantially parallel to each other, each sidewall being substantially perpendicular to the endwall at one end, the walls forming an enclosure having an open end opposing the endwall, the cooling muffler configured for attachment to a device having a rear air exhaust and to redirect airflow peripherally away from the rear of the device, the bottom wall including a notch and a plurality of bridge lances;   each sidewall including an exhaust opening; and   at least a portion of the interior of each wall of the enclosure being covered by sound absorbing material for attenuating air cooling sound.   
     
     
         2 . The acoustic cooling apparatus of  claim 1  wherein substantially the entire interior of each wall of the enclosure is covered by sound absorbing material selected based on the frequency of air cooling sound being attenuated. 
     
     
         3 . The acoustic cooling apparatus of  claim 1  wherein the sound absorbing material is selected in thickness, porosity and material type for attenuating cooling sound entering said open end, allowing the cooling sound energy to penetrate the sound absorbing material, compressing the sound absorbing material at a microscopic level. 
     
     
         4 . The acoustic cooling apparatus of  claim 3  wherein the sound absorbing material is selected to allow the cooling sound energy to penetrate into the sound absorbing material, causing recoil of the sound absorbing material and pulling back on the sound absorbing material being compressed by the sound energy, thereby canceling some of the sound energy by converting it to heat. 
     
     
         5 . The acoustic cooling apparatus of  claim 1  wherein each sidewall opening includes multiple dividing bars. 
     
     
         6 . The acoustic cooling apparatus of  claim 1  comprising four rectangular sidewalls and a square endwall, the sidewalls being substantially parallel to each other, each sidewall being substantially perpendicular to the endwall at one end and connected to side of the endwall square, the walls forming an enclosure having a square open end opposing the endwall. 
     
     
         7 . A method of attenuating cooling sounds from a computing system, comprising:
 providing an acoustic cooling apparatus comprising: a cooling muffler comprising sidewalls, a bottom wall and an endwall, the sidewalls being substantially parallel to each other, each sidewall being substantially perpendicular to the endwall at one end, the walls forming an enclosure having an open end opposing the endwall, each sidewall including an exhaust opening, at least a portion of the interior of each wall of the enclosure being covered by sound absorbing material for attenuating air cooling sound, the bottom wall including a notch and a plurality of bridge lances, the cooling muffler configured for attachment to a device having a rear air exhaust and to redirect airflow peripherally away from the rear of the device; and   connecting the open end of the acoustic cooling apparatus to a cooling device such that cooling air enters the open end and exits the exhaust openings, whereby the acoustic cooling apparatus substantially prevents line of sight between the sound generated by the cooling device and the outside environment.   
     
     
         8 . The method of  claim 7  wherein substantially the entire interior of each wall of the enclosure is covered by sound absorbing material selected based on the frequency of air cooling sound being attenuated. 
     
     
         9 . The method of  claim 7  wherein the sound absorbing material is selected in thickness, porosity and material type for attenuating cooling sound entering said open end, allowing the cooling sound energy to penetrate the sound absorbing material, compressing the sound absorbing material at a microscopic level. 
     
     
         10 . The method of  claim 9  wherein the sound absorbing material is selected to allow the cooling sound energy to penetrate into the sound absorbing material, causing recoil of the sound absorbing material and pulling back on the sound absorbing material being compressed by the sound energy, thereby canceling some of the sound energy by converting it to heat. 
     
     
         11 . The method of  claim 7  wherein each sidewall opening includes multiple dividing bars. 
     
     
         12 . The method of  claim 7  wherein the acoustic device comprises four rectangular sidewalls and a square endwall, the sidewalls being substantially parallel to each other, each sidewall being substantially perpendicular to the endwall at one end and connected to side of the endwall square, the walls forming an enclosure having a square open end opposing the endwall. 
     
     
         13 . The acoustic cooling apparatus of  claim 1 , wherein the muffler device comprises a rear hinged door configured to latch onto the rear of the device having rear exhaust fans. 
     
     
         14 . The acoustic cooling apparatus of  claim 1 , wherein the muffler device turns all air exhaust at angles needed without a ducting shell. 
     
     
         15 . The acoustic cooling apparatus of  claim 1 , wherein depth of the muffler device reduces air turbulence before redirection out of the exhaust openings. 
     
     
         16 . The method of  claim 7 , further comprising:
 placing the muffler device directly against a wall, wherein floor space required for the cooling apparatus in an office environment is minimized.