Active wafer probe

Abstract

A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test.

1 . A probe for testing a device under test comprising:
 (a) an elongate probing element;   (b) a resistive element supported by a substrate wherein said resistive element is less than 10,000 ohms and greater than 100 ohms, wherein the input capacitance of the probe is less than 1,000 fF;   (c) a flexible structure interconnecting said resistive element and a supporting structure such that when said probing element comes into contact with said device under test said flexible structure flexes;   (d) a transmission structure electrically interconnected to said resistive element.   
     
     
         2 . The probe of  claim 1  wherein said resistive element is less than 2,500 ohms 
     
     
         3 . The probe of  claim 1  wherein said resistive element is less than 1,000 ohms 
     
     
         4 . The probe of  claim 1  wherein said input capacitance is less than 100 fF. 
     
     
         5 . The probe of  claim 1  wherein said input capacitance is less than 25 fF. 
     
     
         6 . The probe of  claim 1  wherein the capacitance of said resistive material is less than 10 fF. 
     
     
         7 . A probe for testing a device under test comprising:
 (a) an elongate probing element;   (b) said probing element free from incurring substantial flexing under a probing condition of less than 10 grams of pressure while establishing effective probing of a device under test;   (c) a flexible structure interconnecting said probing element and a supporting structure such that when said probing element comes into contact with said device under test said flexible structure flexes;   (d) a transmission structure electrically interconnected to said probing element.