Wafer probe

Abstract

The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

1 . A method of assembling a probe comprising:
 (a) providing a substantially rigid support supporting a plurality of conductive traces;   (b) providing a unitary assembly including a plurality of contact fingers, such that said plurality of contact fingers are maintained in a predetermined alignment and one end of at least one of said contact fingers is free of attachment to another of said contact fingers for a major portion of a length of said contact finger;   (c) securing a portion of said major portion of each of said contact fingers free of attachment to another of said contact fingers to secure said contact fingers to a traces on said support.   
     
     
         2 . The method of  claim 1  wherein a plurality of said contact fingers extend in a radially outward direction from said support. 
     
     
         3 . The method of  claim 2  wherein the arrangement of said contact fingers match the geometry of a contacting pad on a device under test. 
     
     
         4 . The method of  claim 1  wherein said support includes a resistor capacitor network interconnected to said contact fingers. 
     
     
         5 . The method of  claim 1  wherein said support is a planar circuit board. 
     
     
         6 . The method of  claim 1  wherein said unitary assembly includes a tab proximate the ends of said plurality of contact fingers that maintains said contact fingers in said predetermined alignment. 
     
     
         7 . The method of  claim 6  wherein said tab is removed prior to probing with said contact fingers.