Joint with first and second members with a joining layer located therebetween containing sn metal and another metallic material; methods for forming the same

Abstract

The present invention relates to a joint ( 10 ) that includes a first member ( 11 ) to be jointed, a second member ( 12 ) to be jointed and a jointing layer ( 13 ) located between the first member ( 11 ) and the second member ( 12 ). The jointing layer ( 13 ) is made of Sn metal and a metallic material with a melting point higher than the melting point of the Sn metal. The present invention relates also to a method of joining this first member ( 11 ) to the second member ( 12 ).

1 . A joints comprising a first member to be jointed, a second member to be jointed and a jointing layer located between said first member and said second member, wherein said jointing layer is made of Sn metal and a metallic material except Pb with a melting point higher than the melting point of said Sn metal. 
     
     
         2 . The joints as set forth in  claim 1 ,
 wherein said jointing layer includes a metallic element of at least one of said first member and said second member.   
     
     
         3 . The joints as set forth in  claim 1 ,
 wherein said jointing layer includes a metallic element independent from said first member and said second member.   
     
     
         4 . The joints as set forth in  claim 1 ,
 wherein said Sn metal and said metallic material constitute an intermetallic compound or alloy.   
     
     
         5 . The joints as set forth in  claim 1 ,
 wherein said jointing layer has a solidus line temperature of 270 degrees centigrade or over.   
     
     
         6 . The joints as set forth in  claim 1 ,
 wherein the content of said Sn metal in said jointing layer is within 20 to 70 wt %.   
     
     
         7 . The joints as set forth in  claim 1 ,
 wherein said first member and said second member are made of at least one selected from the group consisting of Cu, Au, Ni, Ag, Pd, Pt, Al, Ge, Be, Nb, Mn, B and an alloy thereof.   
     
     
         8 . The joints as set forth in  claim 4 ,
 wherein said intermetallic compound or alloy is made of at least one of Cu element and Ag element, and Sn element.   
     
     
         9 . The joints as set forth in  claim 1 ,
 wherein said jointing layer is made of a plurality of layers with the respective different mass ratio.   
     
     
         10 . The joints as set forth in  claim 1 ,
 wherein the thickness of said jointing layer is within 1 to 20 micron meter.   
     
     
         11 . The joints as set forth in  claim 1 ,
 further comprising a metallized layer formed on at least one of said first member and said second member.   
     
     
         12 . The joints as set forth in  claim 11 ,
 wherein said metallized layer is made of at least one selected from the group consisting of Cu, Ag, Ti, Ni and Au.   
     
     
         13 . The joints as set forth in  claim 11 ,
 wherein the thickness of said metallized layer is within 0.1 to 500 micron meter.   
     
     
         14 . The joints as set forth in  claim 12 ,
 wherein said first member and said second member are made at least one of Si, SiC, ZnO, Al 2 O 3 , GaAs, GaAlAs, Cu and Fe—Ni.   
     
     
         15 . A jointing method comprising:
 preparing a first member to be jointed and a second member to be jointed;   forming an Sn film on at least one of said first member and said second member; and   pressing said first member and said second member via said Sn film within a temperature range of 250 to 450 degrees centigrade;   wherein said at least one of said first member and said second member includes a metallic material with a melting point higher than the melting point of said Sn metal.   
     
     
         16 . The jointing method as set forth in  claim 15 ,
 wherein the thickness of said Sn film is set within 1 to 50 micron meter.   
     
     
         17 . The jointing method as set forth in  claim 15 , further comprising forming a metallized layer for enhancing affinity for said Sn film on at least one of said first member and said second member. 
     
     
         18 . A jointing method comprising:
 preparing a first member to be jointed and a second member to be jointed;   forming an Sn film and a metallic material film with a melting point higher than the melting point of Sn metal;   pressing said first member and said second member via said Sn film and said metallic material film within a temperature range of 250 to 450 degrees centigrade.   
     
     
         19 . The jointing method as set forth in  claim 18 ,
 wherein the total thickness of said Sn film and said metallic material film is set within 1 to 50 micron meter.   
     
     
         20 . The jointing method as set forth in  claim 18 , further comprising forming a metallized layer for enhancing affinity for said Sn film on at least one of said first member and said second member.