Printed circuit board and electronic apparatus having a printed circuit board

Abstract

A printed circuit board including: a semiconductor package including a main body including a substantially rectangular parallelepiped shape, and a plurality of solder balls on one face of the main body; a board including a first face, a second face, and a hole portion, the first face including a mounting area where the plurality of solder balls are configured to be attached, the second face being opposite to the first face, the hole portion being formed around the mounting area and connected to a conductive pattern, the conductive pattern being configured to be connectable to an electronic component mounted on the board; and a bonding portion configured to bond the semiconductor package to the board, the bonding portion including a portion disposed in the hole portion.

1 . A printed circuit board comprising:
 a semiconductor package comprising a main body comprising a plurality of solder on one face of the main body;   a board comprising a first face comprising a mounting area for the plurality of solder, a second face being opposite to the first face, and one or more holes positioned substantially near the mounting area and comprising a conductive pattern, the conductive pattern electrically connectable; and   one or more attachments located at or near the one or more holes to attach the semiconductor package to the board.   
     
     
         2 . The printed circuit board of  claim 1 , wherein at least one of the one or more holes are located substantially near the mounting area and at or adjacent to at least one of corners of the main body. 
     
     
         3 . The printed circuit board of  claim 2 , wherein:
 The one or more holes comprises a plurality of hole portions; and   the plurality of hole portions are formed around the mounting area and in or next to a corner of the main body.   
     
     
         4 . The printed circuit board of  claim 3 , wherein the one or more holes are configured to penetrate the board from the first face to the second face. 
     
     
         5 . An electronic apparatus comprising:
 a casing; and   a printed circuit board in the casing, the printed circuit board comprising:   a semiconductor package comprising a main body comprising a plurality of solder on one face of the main body;   a board comprising a first face comprising a mounting area, a second face being opposite to the first face, and one or more holes substantially near the mounting area, a surface of the one or more holes being covered with a conductive member that is connected to a conductive pattern, the conductive pattern being configured to be connectable to an electronic component mounted on the board; and   one or more attachments located at or near the one or more holes to attach the semiconductor package to the board.   
     
     
         6 . The electronic apparatus of  claim 5 , wherein the one or more holes are provided substantially near the mounting area and is at or next to at least one of corners of the main body. 
     
     
         7 . The electronic apparatus of  claim 6 , wherein:
 the one or more hole portions comprises a plurality of hole portions; and   the plurality of hole portions are formed substantially near the mounting area and at or adjacent to a corner of the main body.   
     
     
         8 . The electronic apparatus of  claim 7 , wherein the one or more holes are configured to penetrate the board from the first face to the second face.