US2010237395A1PendingUtilityA1

Semiconductor device with gate dielectric containing mixed rare earth elements

Assignee: TOKYO ELECTRON LTDPriority: Mar 31, 2006Filed: May 17, 2010Published: Sep 23, 2010
Est. expiryMar 31, 2026(expired)· nominal 20-yr term from priority
Inventors:Robert D. Clark
H10P 14/69397H10P 14/69396H10P 14/6339H10P 14/6336H10D 64/01342C23C 16/308H10D 64/691H10D 30/60H10D 1/68H10D 1/66C23C 16/40C23C 16/34
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Claims

Abstract

A semiconductor device, such as a transistor or capacitor, is provided. The device includes a substrate, a gate dielectric over the substrate, and a conductive gate electrode film over the gate dielectric. The gate dielectric includes a mixed rare earth nitride or oxynitride film containing at least two different rare earth metal elements.

Claims

exact text as granted — not AI-modified
1 . A semiconductor device comprising:
 a substrate;   a gate dielectric over the substrate, wherein the gate dielectric comprises a mixed rare earth nitride or oxynitride film containing at least two different rare earth metal elements and having a thickness between about 5 and about 40 angstrom; and   a conductive gate electrode film over the gate dielectric.   
     
     
         2 . The device of  claim 1 , wherein the at least two different rare earth metal elements are selected from Y, Lu, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, and Yb. 
     
     
         3 . The device of  claim 1 , wherein the device is a transistor. 
     
     
         4 . The device of  claim 1 , wherein the device is a capacitor. 
     
     
         5 . The device of  claim 1 , further comprising an interface layer between the substrate and the gate dielectric, wherein the interface layer comprises a nitride layer or an oxynitride layer. 
     
     
         6 . A semiconductor device comprising:
 a substrate;   a gate dielectric over the substrate, wherein the gate dielectric comprises a mixed rare earth oxynitride film of the following formula:
   RE1 x RE2 y O m N n    
   
       wherein RE1 and RE2 are different and are each rare earth metal elements selected from Y, Lu, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, and Yb, and wherein x, y, m, and n are non-zero numbers, the mixed rare earth oxynitride film having a thickness between about 5 and about 40 angstrom; and
 a conductive gate electrode film over the gate dielectric. 
 
     
     
         7 . The device of  claim 6 , wherein the device is a transistor. 
     
     
         8 . The device of  claim 6 , wherein the device is a capacitor. 
     
     
         9 . The device of  claim 6 , further comprising an interface layer between the substrate and the gate dielectric, wherein the interface layer comprises an oxide layer, a nitride layer, or an oxynitride layer. 
     
     
         10 . A semiconductor device comprising:
 a substrate;   a gate dielectric over the substrate, wherein the gate dielectric comprises a mixed rare earth nitride film of the following formula:
   RE1 x RE2 y N n    
   
       wherein RE1 and RE2 are different and are each rare earth metal elements selected from Y, Lu, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, and Yb, and wherein x, y, and n are non-zero numbers; and
 a conductive gate electrode film over the gate dielectric. 
 
     
     
         11 . The device of  claim 10 , wherein the device is a transistor. 
     
     
         12 . The device of  claim 10 , wherein the device is a capacitor. 
     
     
         13 . The device of  claim 10 , further comprising an interface layer between the substrate and the gate dielectric, wherein the interface layer comprises an oxide layer, a nitride layer, or an oxynitride layer.

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