Prepreg having uniform permittivity, and metal clad laminates and print wiring board using the same

Abstract

A prepreg, and a metal clad laminate and printed wiring board including the prepreg. The prepreg includes a substrate and a liquid crystal polymer resin impregnated into the substrate, and has a surface roughness in a range of 0.1 to 5.0 μm on one or both surfaces thereof.

1 . A prepreg comprising:
 a substrate; and   a liquid crystal polymer resin that is impregnated into the substrate,   wherein the prepreg has a surface roughness in a range of 0.1 to 5.0 μm on one or both surfaces thereof.   
     
     
         2 . The prepreg of  claim 1 , wherein an impregnation rate of the liquid crystal polymer resin is in a range of 44 to 52 wt % based on the total weight of the substrate and the liquid crystal polymer resin. 
     
     
         3 . The prepreg of  claim 1 , further comprising a liquid crystal polymer resin layer formed such that some of the liquid crystal polymer resin impregnated into the substrate is exuded to a surface of the substrate. 
     
     
         4 . The prepreg of  claim 3 , wherein a thickness of the liquid crystal polymer resin layer accounts for 9 to 23% of the total thickness of the substrate and the liquid crystal polymer resin layer. 
     
     
         5 . The prepreg of  claim 1 , wherein the substrate comprises at least one selected from the group consisting of a glass fiber fabric, a glass fiber woven fabric, a glass fiber non-woven fabric, and a carbon fiber fabric. 
     
     
         6 . The prepreg of  claim 1 , wherein the liquid crystal polymer resin comprises at least one selected from the group consisting of polyester, polyamide, polyimide, polyesteramide, polyesterimide, polyphosphazene, and polyazomethine. 
     
     
         7 . The prepreg of  claim 1 , having a relative dielectric constant of 4.0 or less in a high-frequency range of 1 GHz or more, and having a standard deviation in the relative dielectric constant of 0.1 or less. 
     
     
         8 . A metal clad laminate according to  claim 1 , formed such that at least two sheets of the prepreg are stacked, and a metal thin film disposed on one or both surfaces of the prepreg or the prepreg laminate. 
     
     
         9 . The metal clad laminate of  claim 8 , further comprising a liquid crystal polymer correction layer disposed between the prepreg and the metal thin film. 
     
     
         10 . The metal clad laminate of  claim 9 , wherein the liquid crystal polymer correction layer is inserted, in the form of a film, between the prepreg and the metal thin film. 
     
     
         11 . The metal clad laminate of  claim 9 , wherein the liquid crystal polymer correction layer is formed by coating a surface of the prepreg or a surface of the metal thin film with a liquid crystal polymer resin varnish. 
     
     
         12 . The metal clad laminate of  claim 9 , wherein a thickness of the liquid crystal polymer correction layer accounts for 5 to 30% of an average thickness of the prepreg. 
     
     
         13 . The metal clad laminate of  claim 8 , wherein a bond strength between the prepreg and the metal thin film adhered to the prepreg is in a range of 0.5 to 2.5 N/mm. 
     
     
         14 . A printed wiring board obtained by forming a circuit in the metal clad laminate according to  claim 8 . 
     
     
         15 . A metal clad laminate comprising a printed wiring board according to  claim 14 , a prepreg or prepreg laminate that is disposed on at least a surface of the printed wiring board, and a metal thin film that is disposed on the prepreg or the prepreg laminate.