Method for cleaning heat mode type recording material layer, method for manufacturing pit-projection product, method for manufacturing light emitting element, and method for manufacturing optical element

Abstract

A method for cleaning a heat mode type recording material layer to remove debris generated when a plurality of recessed portions are formed in a thermally deformable heat mode recording material layer by application of condensed light is provided, which method includes using a liquid inactive to the recording material layer, to thereby remove the debris. This method for cleaning a heat mode type recording material layer is applicable to a method for manufacturing a pit-projection product, a method for manufacturing a light emitting element, and a method for manufacturing an optical element.

1 . A method for cleaning a heat mode type recording material layer to remove debris generated when a plurality of recessed portions are formed in a thermally deformable heat mode recording material layer by application of condensed light, which comprises:
 using a liquid inactive to the recording material layer, to thereby remove the debris.   
     
     
         2 . The method for cleaning a heat mode type recording material layer according to  claim 1 , wherein a period of time elapsing from a time at which the recessed portions have been formed to a time at which removal of the debris is started is in the range of 0.1 second to 72 hours. 
     
     
         3 . The method for cleaning a heat mode type recording material layer according to  claim 1 , wherein the liquid contains at least one of hydrocarbon solvents, fluorinated solvents and water. 
     
     
         4 . The method for cleaning a heat mode type recording material layer according to  claim 1 , which comprises supplying the liquid onto the recording material layer, and thereafter turning the recording material layer along a surface thereof, thereby washing the debris away from inside to outside of the recording material layer by the liquid. 
     
     
         5 . The method for cleaning a heat mode type recording material layer according to  claim 4 , which comprises continuing to turn the recording material layer after washing the debris away, thereby drying the recording material layer. 
     
     
         6 . The method for cleaning a heat mode type recording material layer according to  claim 1 , which comprises supplying the liquid onto part of the recording material layer while turning the recording material layer along a surface thereof, thereby washing the debris away from inside to outside of the recording material layer by the liquid. 
     
     
         7 . The method for cleaning a heat mode type recording material layer according to  claim 6 , which comprises continuing to turn the recording material layer after washing the debris away, thereby drying the recording material layer. 
     
     
         8 . A method for manufacturing a pit-projection product having pits and projections on a surface of a substrate, comprising the steps of:
 forming a thermally deformable heat mode recording material over the surface of the substrate;   forming a plurality of recessed portions in the recording material layer by applying condensed light thereto;   removing the debris by the cleaning method according to  claim 1 ; and   forming holes corresponding to the recessed portions in the surface of the substrate by etching using the recording material layer as a mask.   
     
     
         9 . A method for manufacturing a light emitting element with a luminous body, comprising the steps of:
 forming a thermally deformable heat mode recording material over a light emission surface;   forming a plurality of recessed portions in the recording material layer by applying condensed light thereto; and   removing the debris by the cleaning method according to  claim 1 .   
     
     
         10 . The method for manufacturing a light emitting element according to  claim 9 , which comprises forming holes corresponding to the recessed portions in the light emission surface by etching using the recording material layer from which the debris have been removed, as a mask. 
     
     
         11 . A method for manufacturing an optical element to be mounted over a light emission surface of a light emitting element to improve a luminous efficiency of the light emitting element, comprising the steps of:
 forming a thermally deformable heat mode recording material layer over a surface of a supporting member which allows light emitted from the light emitting element to pass therethrough;   forming a plurality of recessed portions in the recording material layer by applying condensed light thereto; and   removing the debris by the cleaning method according to  claim 1 .   
     
     
         12 . The method for manufacturing an optical element according to  claim 11 , which comprises forming holes corresponding to the recessed portions in the surface of the supporting member by etching using the recording material layer as a mask.