Solid-state imaging device and imaging apparatus

Abstract

A solid-state imaging device includes: an imaging region including a plurality of light-receiving parts; a first transfer section provided on the imaging region and transferring, in a first direction, signals generated by the light-receiving parts; a second transfer section provided at a first side of the imaging region and transferring, in a second direction intersecting the first direction, the signals transferred from the first transfer section; an output circuit for outputting the signals; and bonding pads provided at the first side of the imaging region with the second transfer section sandwiched between the imaging region and the bonding pads. The bonding pads are arranged in a plurality of rows each extending in the second direction. Each of the bonding pads in one of the rows at least partially overlaps one of the bonding pads in another one of the rows when viewed in the first direction.

1 - 12 . (canceled) 
     
     
         13 . An imaging apparatus, comprising:
 a solid-state imaging device including
 an imaging region including a plurality of light-receiving parts for converting the light from the second optical member into signals, 
 a first transfer section provided on the imaging region and transferring, in a first direction, the signals generated by the light-receiving parts, 
 a second transfer section provided at a first side of the imaging region in the first direction and transferring, in a second direction intersecting the first direction, the signals transferred from the first transfer section, 
 an output circuit for outputting the signals transferred from the second transfer section, and 
 a plurality of bonding pads provided at the first side of the imaging region with the second transfer section sandwiched between the imaging region and the bonding pads and arranged in a plurality of rows each extending in the second direction, and 
   an electronic member formed on the solid-state imaging device and connected to the bonding pads.   
     
     
         14 . The imaging apparatus of  claim 13 , wherein the electronic member receives a signal output from the solid-state imaging device. 
     
     
         15 . The imaging apparatus of  claim 13 , further comprising a connecting member for connecting the solid-state imaging device to the electronic member. 
     
     
         16 . The imaging apparatus of  claim 15 , wherein the connecting members are bumps. 
     
     
         17 . The imaging apparatus of  claim 14 , further comprising a connecting member for connecting the solid-state imaging device to the electronic member. 
     
     
         18 . The imaging apparatus of  claim 17 , wherein the connecting members are bumps. 
     
     
         19 . The imaging apparatus of  claim 13 , wherein the first transfer section is vertical CCDs, and the second transfer section is horizontal CCDs. 
     
     
         20 . The solid-state imaging device of  claim 19 , wherein the bonding pads include an output pad for outputting the signals from the output circuit to outside the device, a power-supply pad, a ground pad, a substrate contact pad, a first drive pad for receiving a drive signal for the vertical CCDs, and a second drive pad for receiving a drive signal for the horizontal CCDs, and
 the output pad is adjacent to one of the power-supply pad, the ground pad, and the substrate contact pad.   
     
     
         21 . The imaging apparatus of  claim 13 , wherein none of the bonding pads in one of the rows overlaps any of the bonding pads in another one of the rows when viewed in the second direction. 
     
     
         22 . The imaging apparatus of  claim 13 , further comprising lines each extending from one of the bonding pads to one of the imaging region, the second transfer section, and the output circuit, and
 connection portions of some of the bonding pads connected to associated ones of the lines shift, in the second direction, from connection portions of the other bonding pads connected to associated ones of the lines depending on the locations of the bonding pads.   
     
     
         23 . The imaging apparatus of  claim 13 , further comprising bonding pads provided at a second side of the imaging region in the first direction,
 wherein the bonding pads at the second side of the imaging region are arranged in a plurality of separate rows each extending in the second direction, and   each of the bonding pads in one of the rows at the second side of the imaging region at least partially overlaps one of the bonding pads in another one of the rows at the second side of the imaging region when viewed in the first direction.   
     
     
         24 . The imaging apparatus of  claim 13 , wherein each of the bonding pads at the first side of the imaging region is in the shape of a rectangle whose length in the first direction is larger than the length thereof in the second direction. 
     
     
         25 . The imaging apparatus of  claim 13 , further comprising a peripheral circuit provided at the first side of the solid-state imaging device with at least one of the bonding pads sandwiched between the peripheral circuit and the imaging region. 
     
     
         26 . The imaging apparatus of  claim 13 , wherein the first transfer section is vertical signal lines,
 a second transfer section is a horizontal signal line, and   the signals generated by the light-receiving parts are read out to the vertical signal lines via MOS transistors.   
     
     
         27 . The imaging apparatus of  claim 13 , wherein the solid-state imaging device further includes bonding pads provided at a second side of the imaging region in the first direction,
 the bonding pads at the second side of the imaging region are arranged in a plurality of separate rows each extending in the second direction, and   each of the bonding pads in one of the rows at the second side of the imaging region at least partially overlaps one of the bonding pads in another one of the rows at the second side of the imaging region when viewed in the first direction.   
     
     
         28 . The imaging apparatus of  claim 13 , the solid-state imaging device includes a power-supply pad or a ground pad. 
     
     
         29 . The imaging apparatus of  claim 13 , wherein the bonding pads include an output pad which is adjacent to a direct-current terminal and separated from a alternating-current terminal. 
     
     
         30 . The imaging apparatus of  claim 13 , wherein the bonding pads are arranged in more than three rows each extending in the second direction. 
     
     
         31 . The imaging apparatus of  claim 25 , wherein the peripheral circuit is an internal-voltage generating circuit as a heat source.