Optical semiconductor device, socket, and optical semiconductor unit

Abstract

An optical semiconductor unit of the present invention has an LED device provided with an LED (Light Emitting Diode) and a socket to which the LED device is mounted, the LED device has a main body to which the LED is mounted, the main body has a first surface to which block-shaped electrode portions are connected.

1 . An optical semiconductor device comprising:
 a main body to which an optical semiconductor is mounted; and   an electrode portion formed on the main body,   the electrode portion having a block shape as an outer shape.   
   
   
       2 . The optical semiconductor device as claimed in  claim 1 , wherein the electrode portion has a bar-like shape as the outer shape and is connected to the main body along its longitudinal direction. 
   
   
       3 . The optical semiconductor device as claimed in  claim 1 , wherein the electrode portion is divided into a plurality of electrode members having a rectangular prism shape as the outer shape. 
   
   
       4 . The optical semiconductor device as claimed in  claim 1 , wherein the electrode portion has a U shape or a hook shape in section perpendicular to an axial direction thereof. 
   
   
       5 . The optical semiconductor device as claimed in  claim 1 , wherein the electrode portion has a concave portion along a lateral side thereof. 
   
   
       6 . The optical semiconductor device as claimed in  claim 1 , wherein the main body has a first surface having a rectangular planar shape,
 the electrode portion being disposed within a plane of the first surface.   
   
   
       7 . The optical semiconductor device as claimed in  claim 1 , wherein the electrode portion has a total thermal property data not less than a thermal property data of the main body. 
   
   
       8 . The optical semiconductor devise as claimed in  claim 1 , wherein the electrode portion has a total thermal property data not more than five times the thermal property data of the main body. 
   
   
       9 . The optical semiconductor device as claimed in  claim 1 , wherein the optical semiconductor is an LED (Light Emitting Diode) or a semiconductor laser. 
   
   
       10 . A socket mounting the optical semiconductor device claimed in  claim 1  thereon, wherein the socket has a total thermal property data not less than the thermal property data of the main body. 
   
   
       11 . The socket as claimed in  claim 10 , comprising:
 a housing provided with a concave portion into which the electrode portion is inserted; and   a plurality of socket terminals disposed in the concave portion and connected to the electrode portion,   the socket terminals having a total thermal property data not less than the thermal property data of the main body.   
   
   
       12 . The socket as claimed in  claim 11 , wherein the socket terminals comprise metal springs. 
   
   
       13 . An optical semiconductor unit comprising;
 An optical semiconductor device comprising a main body to which an optical semiconductor is mounted and an electrode portion formed on the main body having a block shape as an outer shape; and   A socket mounting the optical semiconductor device, wherein the socket has a total thermal property data not less than the thermal property data of the main body.   
   
   
       14 . A method of designing an optical semiconductor device having a main body to which an optical semiconductor is mounted, and an electrode portion formed on the main body, the method comprising:
 (a) defining an input power supplied to the optical semiconductor and a junction temperature of the optical semiconductor;   (b) obtaining a first graph showing a relationship between a volume of the main body and a temperature of the optical semiconductor at the defined input power and a second graph showing a relationship between a volume of the electrode portion and the temperature of the optical semiconductor at the defined input power;   (c) calculating, from the first and the second graphs, the volumes of the main body and the electrode portion at the junction temperature; and   (d) designing the main body and the electrode portion so that the main body and the electrode portion have the volumes calculated in (c).   
   
   
       15 . A method of designing a socket having a plurality of socket terminals connected to an optical semiconductor device having an optical semiconductor, the method comprising:
 (e) defining an input power supplied to the optical semiconductor and a junction temperature of the optical semiconductor;   (f) obtaining a third graph showing a relationship between a volume of the socket terminals and a temperature of the optical semiconductor at the defined input power;   (g) calculating, from the third graph; the volume of the socket terminals at the junction temperature; and   (h) designing the socket terminals so that the socket terminals have the volume calculated in (g).