Method for manufacturing conductive pattern forming body

Abstract

A method for manufacturing a conductive pattern capable of forming a highly precise pattern, also capable of forming by using a simple process, and being free from problems such as treatment of waste fluids. The method for manufacturing a conductive pattern forming body includes a process of preparing a pattern forming body substrate including a base material, and a photocatalyst containing layer formed on the base material including a photocatalyst and a binder whose wettability of an energy irradiated part is changed so as a contact angle to a liquid is reduced; a process of forming wettability pattern including a liquid repellent area and a lyophilic area on the photocatalyst containing layer by irradiating the photocatalyst containing layer in a pattern with energy; a metal colloid coating process of adhering a metal colloid only to the lyophilic area of the surface of the photocatalyst containing layer on which the wettability pattern is formed, by coating the metal colloid; and a process of forming a conductive pattern by solidifying the metal colloid adhered to the lyophilic area of the wettability pattern.

1 . A method for manufacturing a conductive pattern forming body comprising:
 a process of preparing a pattern forming body substrate comprising a base material, and a photocatalyst containing layer formed on the base material comprising a photocatalyst and a binder whose wettability of an energy irradiated part is changed so as a contact angle to a liquid is reduced;   a process of forming a wettability pattern comprising a liquid repellent area and a lyophilic area on the photocatalyst containing layer by irradiating the photocatalyst containing layer in a pattern with energy;   a metal colloid coating process of adhering a metal colloid only to the lyophilic area of the surface of the photocatalyst containing layer on which the wettability pattern is formed, by coating the metal colloid; and   a process of forming a conductive pattern by solidifying the metal colloid adhered to the lyophilic area of the wettability pattern.   
     
     
         2 . The method for manufacturing a conductive pattern forming body according to  claim 1  wherein the photocatalyst containing layer contains a decomposable material which is decomposed by an action of the photocatalyst by energy irradiation whereby the wettability of the photocatalyst containing layer can be changed. 
     
     
         3 . The method for manufacturing a conductive pattern forming body according to  claim 1  wherein the binder is a layer containing an organopolysiloxane. 
     
     
         4 . The method for manufacturing a conductive pattern forming body according to  claim 3  wherein the organopolysiloxane is a polysiloxane containing a fluoroalkyl group. 
     
     
         5 . The method for manufacturing a conductive pattern forming body according to  claim 1  wherein, after the conductive pattern forming process, the method further comprises a non-drawn part removing process of removing a non-conductive pattern part on which a conductive pattern part is not formed. 
     
     
         6 . The method for manufacturing a conductive pattern forming body according to  claim 1  wherein the metal colloid is a silver colloid or a gold colloid using water as a medium. 
     
     
         7 . The method for manufacturing a conductive pattern forming body according to  claim 1  wherein the coating of the metal colloid in the metal colloid coating process is a dip coating method or a spin coating method. 
     
     
         8 . The method for manufacturing a conductive pattern forming body according to  claim 1  wherein the coating of the metal colloid in the metal colloid coating process is a nozzle discharging method. 
     
     
         9 . The method for manufacturing a conductive pattern forming body according to  claim 8  wherein the nozzle discharging method is an ink jet method. 
     
     
         10 . The method for manufacturing a conductive pattern forming body according to  claim 1  wherein the photocatalyst is titanium dioxide (TiO 2 ). 
     
     
         11 . A method for manufacturing a conductive pattern forming body comprising:
 a process of preparing a pattern forming body substrate comprising a base material, a photocatalyst treatment layer formed on the base material containing at least a photocatalyst, and a wettability variable layer formed on the photocatalyst treatment layer which is a layer whose wettability of an energy irradiated part is changed so as a contact angle to a liquid is reduced;   a process of forming a wettability pattern comprising a liquid repellent area and a lyophilic area on the wettability variable layer by irradiating the wettability variable layer in a pattern with energy;   a metal colloid coating process of adhering a metal colloid only to the lyophilic area of the surface of the wettability variable layer on which the wettability pattern is formed, by coating the metal colloid; and   a process of forming a conductive pattern by solidifying the metal colloid adhered to the lyophilic area of the wettability pattern.   
     
     
         12 . The method for manufacturing a conductive pattern forming body according to  claim 11  wherein the wettability variable layer is a layer containing an organopolysiloxane. 
     
     
         13 . The method for manufacturing a conductive pattern forming body according to  claim 12  wherein the organopolysiloxane is a polysiloxane containing a fluoroalkyl group. 
     
     
         14 . The method for manufacturing a conductive pattern forming body according to  claim 11  wherein, after the conductive pattern forming process, the method further comprises a non-drawn part removing process of removing a non-conductive pattern part on which a conductive pattern part is not formed. 
     
     
         15 . The method for manufacturing a conductive pattern forming body according to  claim 11  wherein the metal colloid is a silver colloid or a gold colloid using water as a medium. 
     
     
         16 . The method for manufacturing a conductive pattern forming body according to  claim 11  wherein the coating of the metal colloid in the metal colloid coating process is a dip coating method or a spin coating method. 
     
     
         17 . The method for manufacturing a conductive pattern forming body according to  claim 11  wherein the coating of the metal colloid in the metal colloid coating process is a nozzle discharging method. 
     
     
         18 . The method for manufacturing a conductive pattern forming body according to  claim 17  wherein the nozzle discharging method is an ink jet method. 
     
     
         19 . The method for manufacturing a conductive pattern forming body according to  claim 11  wherein the photocatalyst is titanium dioxide (TiO 2 ). 
     
     
         20 . A method for manufacturing a conductive pattern forming body comprising:
 a process of preparing a pattern forming body substrate comprising a base material, a photocatalyst treatment layer formed on the base material containing at least a photocatalyst, and a decomposition removal layer formed on the photocatalyst treatment layer which is decomposed and removed by an action of the photocatalyst by energy irradiation;   a process of forming a decomposition removal pattern on the decomposition removal layer by irradiating the decomposition removal layer in a pattern with energy;   a metal colloid coating process of adhering a metal colloid in a pattern to the surface of the decomposition removal layer on which the decomposition removal pattern is formed, by coating the metal colloid; and   a process of forming conductive pattern by solidifying the metal colloid adhered in a pattern.   
     
     
         21 . The method for manufacturing a conductive pattern forming body according to  claim 20  wherein a contact angle of a liquid to the decomposition removal layer is different from the contact angle of a liquid to the photocatalyst treatment layer bared by the decomposition of the decomposition removal layer. 
     
     
         22 . The method for manufacturing a conductive pattern forming body according to  claim 20  wherein the decomposition removal layer is anyone of a self-assembled monolayer, a Langmuir Blodgett film and a layer-by-layer self-assembled film. 
     
     
         23 . The method for manufacturing a conductive pattern forming body according to  claim 20  wherein, after the conductive pattern forming process, the method further comprises a non-drawn part removing process of removing a non-conductive pattern part on which a conductive pattern part is not formed. 
     
     
         24 . The method for manufacturing a conductive pattern forming body according to  claim 20  wherein the metal colloid is a silver colloid or a gold colloid using water as a medium. 
     
     
         25 . The method for manufacturing a conductive pattern forming body according to  claim 20  wherein the coating of the metal colloid in the metal colloid coating process is a dip coating method or a spin coating method. 
     
     
         26 . The method for manufacturing a conductive pattern forming body according to  claim 20  wherein the coating of the metal colloid in the metal colloid coating process is a nozzle discharging method. 
     
     
         27 . The method for manufacturing a conductive pattern forming body according to  claim 26  wherein the nozzle discharging method is an ink jet method. 
     
     
         28 . The method for manufacturing a conductive pattern forming body according to  claim 20  wherein the photocatalyst is titanium dioxide (TiO 2 ). 
     
     
         29 . A conductive pattern forming body comprising: a base material; a photocatalyst containing layer which is a layer formed on the base material whose wettability of an energy irradiated part is changed so as a contact angle to a liquid is reduced, and contains at least a photocatalyst and a binder; and a metal composition formed on the photocatalyst containing layer by solidifying a metal colloid in a pattern. 
     
     
         30 . The conductive pattern forming body according to  claim 29  wherein the photocatalyst containing layer contains a decomposable material which is decomposed by an action of the photocatalyst by energy irradiation and a wettability of the photocatalyst containing layer can be changed by this. 
     
     
         31 . A conductive pattern forming body comprising: a base material; a photocatalyst containing layer which is a layer formed on the base material in a pattern whose wettability of an energy irradiated part is changed so as a contact angle to a liquid is reduced, and contains at least a photocatalyst and a binder; and a metal composition formed on the photocatalyst containing layer by solidifying a metal colloid. 
     
     
         32 . The conductive pattern forming body according to  claim 31  wherein the photocatalyst containing layer contains a decomposable material which is decomposed by an action of the photocatalyst by energy irradiation and a wettability of the photocatalyst containing layer can be changed by this. 
     
     
         33 . A conductive pattern forming body comprising: a base material; a photocatalyst treatment layer contains at least a photocatalyst, on the base material; a wettability variable layer whose wettability of an energy irradiated part is changed so as a contact angle to a liquid is reduced, on the photocatalyst treatment layer; and a metal composition formed on the wettability variable layer by solidifying a metal colloid in a pattern. 
     
     
         34 . A conductive pattern forming body comprising: a base material; a photocatalyst treatment layer contains at least a photocatalyst, on the base material; a wettability variable layer whose wettability of an energy irradiated part is changed so as a contact angle to a liquid is reduced, formed in a pattern on the photocatalyst treatment layer; and a metal composition formed on the wettability variable layer by solidifying a metal colloid. 
     
     
         35 . A conductive pattern forming body comprising: a base material; a photocatalyst treatment layer contains at least a photocatalyst, formed in a pattern on the base material; a wettability variable layer whose wettability of an energy irradiated part is changed so as a contact angle to a liquid is reduced, formed on the photocatalyst treatment layer; and a metal composition formed on the wettability variable layer by solidifying a metal colloid. 
     
     
         36 . A conductive pattern forming body comprising: a base material; a photocatalyst treatment layer contains at least a photocatalyst, on the base material; a decomposition removal layer which is a layer decomposed and removed by an action of the photocatalyst when energy is irradiated, on the photocatalyst treatment layer; and a metal composition formed on the photocatalyst treatment layer which is the decomposition removal layer is decomposed and removed, by solidifying a metal colloid in a pattern. 
     
     
         37 . The conductive pattern forming body according to  claim 36  wherein the decomposition removal layer is any one of a self-assembled monolayer, a Langmuir Blodgett film, and a layer-by-layer self-assembled film. 
     
     
         38 . A conductive pattern forming body comprising: a wettability variable layer whose wettability is changed by an action of a photocatalyst; and a metal composition formed on the wettability variable layer by solidifying a metal colloid in a pattern. 
     
     
         39 . The conductive pattern forming body according to  claim 38  wherein the wettability variable layer is formed on a base material. 
     
     
         40 . The method for manufacturing a conductive pattern forming body according to  claim 38  wherein the wettability variable layer is a layer containing an organopolysiloxane. 
     
     
         41 . The conductive pattern forming body according to  claim 40  wherein the organopolysiloxane is a polysiloxane containing a fluoroalkyl group. 
     
     
         42 . A conductive pattern forming body comprising: a base material; a decomposition removal layer on the base material which is decomposed and removed by an action of a photocatalyst; and a metal composition formed on the base material which is bared by the decomposition and removal of the decomposition removal layer, by solidifying a metal colloid in a pattern. 
     
     
         43 . The conductive pattern forming body according to  claim 42  wherein a contact angle of the decomposition removal layer to a liquid is different from a contact angle of the base material, which is bared by the decomposition of the decomposition removal layer, to a liquid. 
     
     
         44 . The conductive pattern forming body according to  claim 42  wherein the decomposition removal layer is any one of a self-assembled monolayer, a Langmuir Blodgett film and a layer-by-layer self-assembled film. 
     
     
         45 . A conductive pattern forming body comprising: a base material; a wettability variable layer formed in a pattern on the base material whose wettability is changed by an action of a photocatalyst; and a metal composition formed on the wettability variable layer, by solidifying a metal colloid.