Silicon optical package with 45 degree turning mirror

Abstract

An optical package includes a sub-mount, an edge-emitting laser mounted on the sub-mount, a collimating ball lens mounted on the sub-mount adjacent to the edge-emitting laser, a mirror mounted on the sub-mount adjacent to the collimating ball lens. The sub-mount is made of a bottom wafer. A lid is bonded to the sub-mount to form the laser package. The lid is made of a middle wafer bonded to a top wafer. The middle wafer defines an opening that accommodates the edge-emitting laser, the collimating ball lens, and the mirror. The opening is defined by vertical sidewalls. The top wafer further includes a lens above the mirror.

1 - 16 . (canceled) 
     
     
         17 . A package, comprising:
 a sub-mount, comprising a bottom wafer; an edge-emitting laser mounted atop the bottom wafer;   a collimating ball lens mounted atop the bottom wafer adjacent to the edge-emitting laser;   a lid mounted atop the sub-mount, comprising:
 a middle wafer defining an opening accommodating the collimating ball lens and the edge-emitting laser, the opening being defined by at least one angled sidewall, the angled sidewall comprising a turning mirror adjacent to the collimating ball lens; 
 a top wafer atop the middle wafer, the top wafer comprising a converging lens, wherein edge-emitting laser emits a light through the collimating ball lens onto the turning mirror, and the turning mirror directing the light through the lid at the lens. 
   
     
     
         18 . The package of  claim 17 , wherein:
 the bottom wafer defines a ball pit between mounting locations of the edge-emitting laser and the angled sidewall; and   the collimating ball lens is mounted in the ball pit so that the collimating ball lens is located between the edge-emitting laser and the mirror.   
     
     
         19 . The package of  claim 17 , further comprising:
 a detector mounted atop the bottom wafer in the opening adjacent to the edge-emitting laser; and   at least one of a temperature sensor and an impedance matching resistor.   
     
     
         20 . The package of  claim 17 , wherein the top wafer comprises Pyrex, the middle wafer comprises silicon, and the bottom wafer comprises silicon, the package further comprising an anodic bond between the middle wafer and the top wafer. 
     
     
         21 . The package of  claim 17 , wherein the sub-mount further comprises a trace and a bond wire connecting the edge-emitting laser and the trace. 
     
     
         22 - 36 . (canceled)