Lightweight carrier structure, particularly for optical components, and method for its production

Abstract

A carrier structure ( 100 ), particularly for optical components, includes a carrier body ( 10 ) which is formed from ceramic with hollows ( 11 ), and at least one cover layer ( 21, 22 ) which is formed from glass, arranged on at least one surface of the carrier body ( 10 ), and is connected to the carrier body ( 10 ) by means of at least one bond connection ( 23, 24 ) produced by means of anodic bonding. Methods for producing the carrier structure ( 100 ) and the use of the carrier structure as a mirror body, carrier for optical components and/or mechanical carrier for dynamically moved components are also described.

1 . A carrier structure comprising:
 a carrier body comprising ceramic with hollows, and   at least one cover layer comprising glass and arranged on at least one surface of the carrier body,   wherein the at least one cover layer is connected to the carrier body by at least one bond connection produced by anodic bonding.   
     
     
         2 . The carrier structure according to  claim 1 , wherein the carrier body is formed from electrically conductive ceramic or carries an electrically conductive bond layer. 
     
     
         3 . The carrier structure according to  claim 1 , wherein the carrier body is formed from SiC ceramic. 
     
     
         4 . The carrier structure according to  claim 3 , wherein the carrier body is formed from SiSiC ceramic. 
     
     
         5 . The carrier structure according to  claim 1 , wherein the carrier body comprises a composite of a plurality of carrier body parts. 
     
     
         6 . The carrier structure according to  claim 5 , wherein the carrier body parts form a closed hollow structure. 
     
     
         7 . The carrier structure according to  claim 1 , wherein the at least one cover layer comprises two glass layers which are arranged on mutually opposite main surfaces of the carrier body. 
     
     
         8 . The carrier structure according to  claim 1 , wherein at least one reflector layer is provided on at least one surface of the at least one cover layer. 
     
     
         9 . The carrier structure according to  claim 1 , wherein the carrier body and the at least one cover layer form a layer construction with thermal dimensional stability. 
     
     
         10 . The carrier structure according to  claim 1 , wherein at least one of the carrier body and the at least one cover layer have at least one pressure-balance opening. 
     
     
         11 . The carrier structure according to  claim 1 , wherein the carrier structure is adapted to carry at least one of a mirror body, optical components and dynamically moved components. 
     
     
         12 . A method for producing a carrier structure, comprising the steps of:
 providing a carrier body, which is formed from ceramic and has hollows; and   connecting at least one cover layer, which is formed from glass, to at least one surface of the carrier body by anodic bonding.   
     
     
         13 . The method according to  claim 12 , wherein the step of providing the carrier body comprises forming the hollows by a shaping of the ceramic in a precursor state. 
     
     
         14 . The method according to  claim 12 , wherein the at least one cover layer comprises two glass layers which are connected to mutually opposite main surfaces of the carrier body. 
     
     
         15 . The method according to  claim 12 , wherein the step of providing the carrier body comprises forming a composite of a plurality of carrier body parts by anodic bonding. 
     
     
         16 . The method according to  claim 12 , further comprising the step of forming at least one reflector layer on at least one surface of the at least one cover layer. 
     
     
         17 . The method according to  claim 12 , wherein the carrier structure is adapted to carry at least one of a mirror body, optical components and dynamically moved components. 
     
     
         18 . A method of using a carrier structure according to  claim 1 , wherein the carrier structure is at least one of a mirror body, a carrier for optical components and a mechanical carrier for dynamically moved components.