Superhard Cutters and Associated Methods

Abstract

A cutting device comprises a base having a solidified organic material layer disposed thereon. A plurality of individual polycrystalline cutting elements are secured in the solidified organic material layer. Each of the plurality of individual polycrystalline cutting elements has a substantially matching geometric configuration.

1 . A CMP pad dresser comprising:
 a base having a solidified organic material layer disposed thereon; and   a plurality of individual superhard polycrystalline cutting elements, each with a substantially matching geometric configuration, secured in the solidified organic material layer with a widest portion positioned below the organic material layer surface, and a cutting tip aligned in a common plane above the organic material layer surface.   
   
   
       2 . The CMP pad dresser of  claim 1 , wherein the widest portion of each cutting element is closer to one end of the cutting element than to another end of the cutting element. 
   
   
       3 . The CMP pad dresser of  claim 2 , wherein the widest portion of each cutting element is at or near an end most distal from the cutting tip. 
   
   
       4 . The CMP pad dresser of  claim 1 , wherein the cutting elements have a pyramidal shape. 
   
   
       5 . The CMP pad dresser of  claim 4 , wherein the pyramidal shape is asymmetrical. 
   
   
       6 . The CMP pad dresser of  claim 4 , wherein the pyramidal shape is a three-sided pyramid with a cutting tip of 60 degrees. 
   
   
       7 . The CMP pad dresser of  claim 4 , wherein the pyramidal shape is a square pyramid with a cutting tip of 90 degrees. 
   
   
       8 . The CMP pad dresser of  claim 7 , wherein the square pyramid shape is provided by a cube oriented with a 90 degree corner as a cutting tip in the common plane above the organic material layer surface. 
   
   
       9 . The CMP pad dresser of  claim 1 , wherein a ratio of the portion of the cutting element positioned below the organic material layer surface as compared to the portion of the cutting element protruding above the organic material layer surface is from 20 to 1 to about 0.2 to 1. 
   
   
       10 . The CMP pad dresser of  claim 8 , wherein the ratio is about 4 to 1. 
   
   
       11 . The CMP pad dresser of  claim 8 , wherein about ⅔ of the cutting element is positioned below the organic material layer surface and about ⅓ of the cutting element is protrudes above the organic material layer surface. 
   
   
       12 . The CMP pad dresser of  claim 1 , further comprising secondary cutting elements formed on the polycrystalline cutting elements. 
   
   
       13 . The CMP pad dresser of  claim 1 , wherein the superhard polycrystalline cutting elements are either sintered polycrystalline diamond or polycrystalline cubic boron nitride. 
   
   
       14 . The CMP pad dresser of  claim 1 , wherein the organic material layer is a curable resin material. 
   
   
       15 . The CMP pad dresser of  claim 14 , wherein the curable resin material is a thermoplastic material. 
   
   
       16 . The CMP pad dresser of  claim 14 , wherein the curable resin material maintains a flat surface with little or no warping. 
   
   
       17 . The CMP pad dresser of  claim 1 , wherein the solidified organic material layer further comprises a reinforcing material. 
   
   
       18 . The CMP pad dresser of  claim 17 , wherein the reinforcing material includes ceramics, metals, or a combination thereof. 
   
   
       19 . The CMP pad dresser of  claim 18 , wherein the reinforcing material is a ceramic. 
   
   
       20 . The CMP pad dresser of  claim 1 , further comprising an organometallic coupling agent coated on the superhard polycrystalline cutting elements to chemically bond the cutting elements to the solidified organic material layer.