Double Side Polishing Machine

Abstract

The present invention is to provide a double side polishing machine which can apply a load by the upper lapping plate uniformly to works and the deflection of the upper lapping plate is restrained, which comprises a rotatable lower lapping plate, a rotatable upper lapping plate and movable to the lower lapping plate by an elevation mechanism, carriers which are put between the lower lapping plate and the upper lapping plate and in which a plurality of works are mounted, and a rotation and revolution mechanism for rotating and revolving the carriers between the lower lapping plate and the upper lapping plate, wherein a supporting plate for upper lapping plate which suspends the upper lapping plate is connected to an upper portion of a coupling mechanism provided oscillatably on a vertically movable supporting rod of the elevation mechanism, and an oscillation fulcrum of the coupling mechanism is located at approximately same height to a polishing surface of the upper polishing plate.

1 . A double side polishing machine comprising a rotatable lower polishing plate, a rotatable upper polishing plate which goes up and down to said lower polishing plate by means of an elevation mechanism, carriers putting between said lower and said upper polishing plates and installing a plurality of works respectively and a rotation and revolution mechanism for rotating and revolving said carriers between said lower and said upper polishing plates,
 wherein a supporting plate for upper polishing plate which suspends said upper polishing plate is connected to an upper portion of a coupling mechanism is provided oscillatably on vertically movable supporting rod of said elevation mechanism, and   wherein an oscillation fulcrum of said coupling mechanism is positioned at approximately same height to a polishing surface of said upper polishing plate.   
     
     
         2 . A double side polishing machine according to  claim 1 , wherein said upper polishing plate is suspended on said supporting plate outward in a radial direction from a center of gravity in one side of said polishing surface of said upper polishing plate. 
     
     
         3 . A double side polishing machine according to  claim 1 , wherein the supporting plate has a plurality of reinforcement ribs extending along the radiation direction. 
     
     
         4 . A double side polishing machine according to  claim 2 , wherein the supporting plate has a plurality of reinforcement ribs extending along the radiation direction. 
     
     
         5 . A double side polishing machine according to  claim 1 , wherein said coupling mechanism is a gyro-mechanism and a center position of said gyro-mechanism is positioned at approximately same height to said polishing surface of said upper lapping plate. 
     
     
         6 . A double side polishing machine according to  claim 2 , wherein said coupling mechanism is a gyro-mechanism and a center position of said gyro-mechanism is positioned at approximately same height to said polishing surface of said upper lapping plate. 
     
     
         7 . A double side polishing machine according to  claim 3 , wherein said coupling mechanism is a gyro-mechanism and a center position of said gyro-mechanism is positioned at approximately same height to said polishing surface of said upper lapping plate. 
     
     
         8 . A double side polishing machine according to  claim 4 , wherein said coupling mechanism is a gyro-mechanism and a center position of said gyro-mechanism is positioned at approximately same height to said polishing surface of said upper lapping plate. 
     
     
         9 . A double side polishing machine according to  claim 1 , wherein said upper lapping plate can be rotatable by an upper lapping plate rotation mechanism for rotating said supporting rod and said upper lapping plate rotation mechanism is provided on said elevation mechanism. 
     
     
         10 . A double side polishing machine according to  claim 2 , wherein said upper lapping plate can be rotatable by an upper lapping plate rotation mechanism for rotating said supporting rod and said upper lapping plate rotation mechanism is provided on said elevation mechanism. 
     
     
         11 . A double side polishing machine according to  claim 3 , wherein said upper lapping plate can be rotatable by an upper lapping plate rotation mechanism for rotating said supporting rod and said upper lapping plate rotation mechanism is provided on said elevation mechanism. 
     
     
         12 . A double side polishing machine according to  claim 4 , wherein said upper lapping plate can be rotatable by an upper lapping plate rotation mechanism for rotating said supporting rod and said upper lapping plate rotation mechanism is provided on said elevation mechanism. 
     
     
         13 . A double side polishing machine according to  claim 5 , wherein said upper lapping plate can be rotatable by an upper lapping plate rotation mechanism for rotating said supporting rod and said upper lapping plate rotation mechanism is provided on said elevation mechanism. 
     
     
         14 . A double side polishing machine according to  claim 6 , wherein said upper lapping plate can be rotatable by an upper lapping plate rotation mechanism for rotating said supporting rod and said upper lapping plate rotation mechanism is provided on said elevation mechanism. 
     
     
         15 . A double side polishing machine according to  claim 7 , wherein said upper lapping plate can be rotatable by an upper lapping plate rotation mechanism for rotating said supporting rod and said upper lapping plate rotation mechanism is provided on said elevation mechanism. 
     
     
         16 . A double side polishing machine according to  claim 8 , wherein said upper lapping plate can be rotatable by an upper lapping plate rotation mechanism for rotating said supporting rod and said upper lapping plate rotation mechanism is provided on said elevation mechanism.