Heat dissipation device

Abstract

A heat dissipation device for removing heat from a heat-generating component, includes a base and a fin group arranged on a top of the base. The base includes a conducting plate, a retaining bracket attached to a bottom surface of the conducting plate, a plurality of heat pipes located between the conducting plate and the retaining bracket and a heat absorbing block embedded in the retraining bracket. The heat pipes have first portions arranged side by side closely and sandwiched between the conducting plate and the retaining bracket and second portions bent from the first portions away from the retaining bracket in a divergent manner. The heat absorbing block has a top surface in contact with the heat pipes and a bottom surface for contacting with the heat generating component.

1 . A heat dissipation device adapted for removing heat from a heat-generating component, comprising:
 a base comprising a conducting plate, a retaining bracket attached to a bottom surface of the conducting plate, a plurality of heat pipes having first portions sandwiched between the conducting plate and the retaining bracket, and a heat absorbing block embedded in the retraining bracket; and   a fin group arranged on a top surface of the conducting plate of the base and thermally connecting therewith;   wherein the heat absorbing block has a top surface in contact with the heat pipes and a bottom surface adapted for being in contact with the heat generating component.   
   
   
       2 . The heat dissipation device as claimed in  claim 1 , wherein the heat pipes have the first portions arranged closely side by side and second portions bent from the first portions, the second portions being spaced from each other and a distance between two neighboring second portions gradually increasing along a direction from the first portions toward the second portions. 
   
   
       3 . The heat dissipation device as claimed in  claim 2 , wherein the heat pipes have flat top surfaces all in contact with the bottom surface of the conducting plate. 
   
   
       4 . The heat dissipation device as claimed in  claim 1 , wherein the retaining bracket defines an opening therein and a plurality of receiving grooves in the top surface thereof, the receiving grooves being divided into two groups which are spaced from each other by the opening and located at two sides of the opening. 
   
   
       5 . The heat dissipation device as claimed in  claim 4 , wherein the first portions of the heat pipes span over the opening and are received in the receiving grooves and cooperatively define a flat contact surface by bottom surfaces thereof, the flat contact surface being in the opening. 
   
   
       6 . The heat dissipation device as claimed in  claim 5 , wherein the heat absorbing block is received in the opening of the retaining bracket with the top surface thereof in contact with the flat contact surface of the heat pipes. 
   
   
       7 . The heat dissipation device as claimed in  claim 1 , wherein the conducting plate and the heat absorbing block are both made of copper, while the retaining bracket is made of aluminum. 
   
   
       8 . The heat dissipation device as claimed in  claim 1 , wherein the retaining bracket is engaged with the bottom surface of a front half of the conducting plate and has four retaining sleeves extending downwardly from four corners thereof. 
   
   
       9 . The heat dissipation device as claimed in  claim 8 , wherein four rings projecting upwardly from top ends of the retaining sleeves are received in four through holes defined in the conducting plate, the rings having top surfaces thereof coplanar with the top surface of the conducting plate. 
   
   
       10 . The heat dissipation device as claimed in  claim 9 , wherein four fixtures are received in the rings and sleeves for securing the base onto the heat-generating component. 
   
   
       11 . The heat dissipation device as claimed in  claim 10 , wherein the fin group defines four cutouts corresponding to the four through holes of the conducting plate and comprises a plurality of fins spaced from each other and perpendicularly arranged on the conducting plate. 
   
   
       12 . The heat dissipation device as claimed in  claim 1 , wherein two restricting flanges extend upwardly from two opposite lateral sides of the conducting plate and restrict the fin group therebetween. 
   
   
       13 . A heat dissipation device adapted for removing heat from a heat-generating component, comprising:
 a base comprising
 a conducting plate, a retaining bracket attached to a bottom surface of the conducting plate and defining an opening therein, a plurality of heat pipes having first portions arranged side by side closely and sandwiched between the conducting plate and the retaining bracket and second portions bent from the first portions away from the retaining bracket in a divergent manner, and a heat absorbing block received in the opening of retraining bracket having a top surface in contact with the heat pipes and a bottom surface adapted for being in contact with the heat generating component; and 
   a fin group arranged on a top surface of the conducting plate of the base and in thermal connection therewith.   
   
   
       14 . The heat dissipation device as claimed in  claim 13 , wherein the heat pipes have flat top surfaces all in contact with the bottom surface of the conducting plate. 
   
   
       15 . The heat dissipation device as claimed in  claim 13 , wherein a plurality of receiving grooves are defined in the top surface of the retaining bracket, interrupted by the opening and located at two sides of the opening. 
   
   
       16 . The heat dissipation device as claimed in  claim 15 , wherein the first portions of the heat pipes span over the opening and are received in the receiving grooves and cooperatively define a flat contact surface at bottom surfaces thereof, the flat contact surface being in the opening. 
   
   
       17 . The heat dissipation device as claimed in  claim 16 , wherein the heat absorbing block is received in the opening of the retaining bracket with the top surface thereof in contact with the flat contact surface of the heat pipes. 
   
   
       18 . The heat dissipation device as claimed in  claim 13 , wherein the conducting plate and the heat absorbing block are both made of copper, while the retaining bracket is made of aluminum.