Stage device and plasma treatment apparatus

Abstract

The present invention provides a stage device which does not generate the difference in level between an upper end of a lift pin and a setting surface of a stage in a state where a substrate to be treated is set on the setting surface of the stage, and provides a plasma treatment apparatus which suppresses the occurrence of uneven treatment by using the stage device as an electrode stage. At the center of an electrode stage ( 2 ), a spring type lift pin ( 20 ) having elasticity in a direction where the pin moves is provided. When the spring type lift pin ( 20 ) is at a storage position, a pin upper end ( 20 a ) of the spring type lift pin ( 20 ) protrudes above the setting surface ( 11 ) of the electrode stage ( 2 ). When the substrate ( 4 ) to be treated is set and adsorbed on the setting surface ( 11 ), the upper end of the lift pin is pressed down to the position that is at the same level as that of the setting surface ( 11 ) by a load applied by the substrate ( 4 ).

1 . A stage device comprising:
 a stage having a setting surface on which a substrate to be treated is set; and   a lift pin mechanism having first pins, provided in the stage, each capable of emerging from the setting surface, the first pins being protruded so that the substrate is detached from the setting surface,   wherein the lift pin mechanism includes contact adjusting means that brings an upper end of the first pin being withdrawn in the stage into contact with the substrate on the setting surface without lifting the substrate above the setting surface.   
   
   
       2 . The stage device according to  claim 1 , wherein
 the contact adjusting means comprises elasticity function imparting means that imparts to the first pin a function having elasticity in a direction where the first pin moves, and the upper end of the first pin is brought into contact with the substrate by the elasticity imparted by the elasticity function imparting means.   
   
   
       3 . The stage device according to  claim 2 , wherein
 the elasticity function imparting means is an elastic body being provided to the first pin and having elasticity in the direction where the first pin moves.   
   
   
       4 . The stage device according to  claim 2 , wherein
 when each of the first pins is at a storage position where the first pin is withdrawn in the stage, the upper end of the first pin is protruded above the setting surface in a state where the substrate is not set on the setting surface, and the upper end of the first pin is positioned at the same level as the setting surface by a load applied by the substrate in a state where the substrate is set on the setting surface.   
   
   
       5 . The stage device according to  claim 2 , wherein
 when each of the first pins is at a storage position where the first pin is withdrawn in the stage, the upper end of the first pin is positioned below the setting surface in a state where the substrate is not set on the setting surface, and after the substrate is set on the setting surface, the first pin moves upward so that the upper end thereof comes into contact with the substrate.   
   
   
       6 . The stage device according to  claim 1 , wherein
 the stage is provided with an adsorption mechanism that adsorptively holds the substrate on the setting surface.   
   
   
       7 . The stage device according to  claim 6 , wherein
 the adsorption mechanism has a stronger adsorption force in the vicinity of the first pin to which the function having elasticity is imparted than an adsorption force in other area.   
   
   
       8 . The stage device according to  claim 2 , wherein
 the lift pin mechanism has second pins, provided in an outer region of the stage, each capable of emerging from the setting surface and having no elasticity in a direction where the second pin moves, and an upper end of the second pin is positioned below the setting surface in a state where the second pin is withdrawn in the stage.   
   
   
       9 . A plasma treatment apparatus which generates plasma in between an electrode stage and a counter electrode at near atmospheric pressure so as to subject a substrate to be treated set on the electrode stage to plasma treatment, the plasma treatment apparatus including a stage device according to  claim 1  as the electrode stage. 
   
   
       10 . A display panel substrate for use in manufacturing a display panel,
 the display panel substrate being subjected to surface treatment by means of a plasma treatment apparatus according to  claim 9 .