US2010208933A1PendingUtilityA1

Electronic device manufactured by molding, method and mold for manufacturing the same, and electronic application using the same

Assignee: SAMSUNG ELECTRO MECHPriority: Feb 16, 2009Filed: Dec 2, 2009Published: Aug 19, 2010
Est. expiryFeb 16, 2029(~2.6 yrs left)· nominal 20-yr term from priority
H05K 5/00G11B 20/00H01H 9/04B29C 45/14655H04R 1/1075H01H 9/0214B29C 45/14819H04R 1/1041H01H 2223/002H05K 5/06H04R 2201/107H01H 2229/044H01H 9/0235H01H 2231/032B29C 45/14065B29C 2045/14122
51
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

An electronic device manufactured by molding according to an aspect of the invention may include a driving unit supplying a signal upon being pressed and then returning to its original state; a board having the driving unit mounted thereon; a driving unit mold casing unit molded with the driving unit from a resin material such that the driving unit can be driven; and a casing molding unit molded to completely cover the board, together with the driving unit mold casing unit, to form the outer appearance.

Claims

exact text as granted — not AI-modified
1 . An electronic device manufactured by molding, the electronic device comprising:
 a driving unit supplying a signal upon being pressed and then returning to its original state;   a board having the driving unit mounted thereon;   a driving unit mold casing unit molded with the driving unit from a resin material such that the driving unit can be driven; and   a casing molding unit molded to completely cover the board, together with the driving unit mold casing unit, to form the outer appearance.   
     
     
         2 . The electronic device of  claim 1 , wherein the driving mold casing unit and the casing molding unit are distinguished from each other by a difference in mold thickness. 
     
     
         3 . The electronic device of  claim 1 , wherein a support line is provided along an outer circumferential edge of the casing molding unit. 
     
     
         4 . The electronic device of  claim 1 , wherein a microphone is further mounted on the board, and
 a sound transmission hole is provided in the casing molding unit at a position corresponding to the microphone.   
     
     
         5 . The electronic device of  claim 4 , further comprising a protective cap covering the driving unit or the microphone on the board and preventing the direct molding of the driving unit or the microphone. 
     
     
         6 . The electronic device of  claim 5 , wherein the driving unit comprises:
 a button received in a button receiving portion within the protective cap; and   a switch controlling an electrical signal by pushing the button.   
     
     
         7 . The electronic device of  claim 6 , wherein the protective cap comprises the button receiving portion provided on the partition and receiving the button. 
     
     
         8 . The electronic device of  claim 6 , wherein a positioning hole for determining the positions of the switch and the button is provided in the button receiving portion, and
 a protrusion extending from the button is inserted into the positioning hole.   
     
     
         9 . The electronic device of  claim 5 , wherein a sound passing hole corresponding to the sound transmission hole is provided in the protective cap covering the microphone, and
 a mesh is bonded to the sound passing hole to provide waterproofing.   
     
     
         10 . The electronic device of  claim 1 , wherein a support pin hole is provided in the board so that a support pin of a mold is inserted into the support pin hole to fix the board in the mold. 
     
     
         11 . A method of manufacturing an electronic device, the method comprising:
 arranging a board, having a driving unit mounted thereon, between upper and lower molds in which the driving unit, supplying a signal upon being pressed and then returning to its original state, is distinguished from the other circuit components;   inserting a support pin, extending from the upper mold, the lower mold or the upper and lower molds, into a support pin hole of the board so that the board is secured within a cavity between the upper and lower molds; and   injecting a resin material through a resin material injection portion formed at one side of the upper mold, the lower mold or the upper and lower molds so that spaces between the upper and lower molds and the board form a driving unit mold casing unit and a casing molding unit.   
     
     
         12 . The method of  claim 11 , wherein in the arranging of the board between the upper and lower molds, the board is covered with a protective cap to prevent the direct molding of the driving unit. 
     
     
         13 . The method of  claim 11 , wherein when a microphone is mounted onto the board, molding is performed while a sound transmission hole forming pin of the upper or lower mold is in contact with the microphone, so that a sound transmission hole is formed in the casing molding unit at a position corresponding to the microphone. 
     
     
         14 . The method of  claim 11 , wherein the support pin hole in the board comprises at least one support pin hole formed in the edge of the board. 
     
     
         15 . A mold for manufacturing an electronic device, the mold comprising:
 upper and lower molds having a board, having a driving unit mounted thereon, arranged therein, the driving unit supplying a signal upon being pressed and then returning to its original state;   a support pin extending from the upper mold, the lower mold or the upper and lower molds and engaged with a support pin hole provided in the board to thereby secure the board within a cavity between the upper and the lower molds; and   a resin material injection portion provided at the upper mold, the lower mold, or the upper or lower molds, the resin material injection portion through which a resin material is injected into the cavity so that the cavity between the upper and lower molds forms a driving unit mold casing unit and a casing molding unit.   
     
     
         16 . The mold of  claim 15 , wherein the support pin is provided in the upper or lower mold at a position corresponding to the support pin hole provided in the edge of the board. 
     
     
         17 . The mold of  claim 15 , wherein a sound transmission hole forming pin extends from the upper or lower mold so that a sound transmission hole is provided in the casing molding unit at a position corresponding to a microphone when the microphone is mounted onto the board. 
     
     
         18 . The mold of  claim 15 , further comprising a division line forming portion such that the driving mold casing unit is distinguished from the casing molding unit. 
     
     
         19 . The mold of  claim 15 , further comprising a support line forming portion forming a support line along an outer circumferential edge of the casing molding unit to maintain the outer appearance. 
     
     
         20 . A sound transmission device comprising:
 a casing molding unit integrally molded with a driving unit including a switch and a button separated from each other by a partition of a protective cap, the driving unit supplying a signal upon the button being pushed and then returning to its original state;   a jack engaging portion extending from one side of the casing molding unit and being supplied with a sound signal; and   a speaker connected to the other side of the casing molding unit and producing sound being controlled by pressing the driving unit.   
     
     
         21 . The sound transmission device of  claim 20 , wherein the casing molding unit is distinguished from the driving mold casing unit covering the driving unit by a difference in mold thickness. 
     
     
         22 . The sound transmission device of  claim 20 , wherein a support line is provided along an outer circumferential edge of the casing molding unit to maintain the outer appearance. 
     
     
         23 . The sound transmission device of  claim 20 , wherein a microphone is further mounted within the casing molding unit, and
 a sound transmission hole is provided in the casing molding unit at a position corresponding to the microphone.   
     
     
         24 . The sound transmission device of  claim 23 , wherein a sound passing hole corresponding to the sound transmission hole is provided in the protective cap covering the microphone, and
 a mesh is bonded to the sound passing hole to provide waterproofing.   
     
     
         25 . The sound transmission device of  claim 20 , wherein the protective cap comprises a button receiving portion provided on the partition and receiving the button. 
     
     
         26 . The sound transmission device of  claim 25 , wherein a positioning hole is provided in the button receiving portion to determine the positions of the switch and the button, and
 a protrusion extending from the button is inserted into the positioning hole.   
     
     
         27 . A remote controller comprising:
 a casing molding unit integrally molded with a driving unit including a switch and a button separated from each other by a partition of a protective cap, the driving unit supplying a signal upon the button being pushed and then returning to its original state; and   a signal transmission unit provided at one side of the casing molding unit and transmitting a signal from the driving unit to an external starting device or an electronic device.

Join the waitlist — get patent alerts

Track US2010208933A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.