Semiconductor device and method of fabricating the same
Abstract
A semiconductor device according to an embodiment of the present invention includes: a semiconductor substrate; an isolation structure formed in a trench, formed in the semiconductor substrate, through a semiconductor oxide film; a floating gate formed on the semiconductor substrate between the isolation structures through an insulating film; a gate oxidation protection film formed on a side surface, on the isolation structure side, of the floating gate so that each of a part of a side surface and a bottom surface of the gate oxidation protection film contacts the insulating film; and a control gate formed on the floating gate through an inter-gate insulating film.
Claims
exact text as granted — not AI-modified1 . A semiconductor device, comprising:
a semiconductor substrate; an isolation structure formed in a trench, formed in the semiconductor substrate, through a semiconductor oxide film; a floating gate formed on the semiconductor substrate between the isolation structures through an insulating film; a gate oxidation protection film formed on a side surface, on the isolation structure side, of the floating gate so that each of a part of a side surface and a bottom surface of the gate oxidation protection film contacts the insulating film; and a control gate formed on the floating gate through an inter-gate insulating film.
2 . The semiconductor device according to claim 1 , wherein the gate oxidation protection film includes at least one of a silicon oxide, a silicon nitride and a silicon oxynitride.
3 . The semiconductor device according to claim 1 , wherein the isolation structure includes a silicon oxide.
4 . The semiconductor device according to claim 1 , wherein the insulating film includes at least one of a silicon oxide and a silicon nitride.
5 . The semiconductor device according to claim 1 , wherein the inter-gate insulating film includes at least one of a silicon oxide and a silicon nitride.
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