US2010207188A1PendingUtilityA1

Semiconductor device and method of fabricating the same

Assignee: TOSHIBA KKPriority: Sep 26, 2006Filed: Apr 23, 2010Published: Aug 19, 2010
Est. expirySep 26, 2026(~0.2 yrs left)· nominal 20-yr term from priority
H10D 64/035H10D 30/6894H10B 69/00H10B 41/30
43
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Claims

Abstract

A semiconductor device according to an embodiment of the present invention includes: a semiconductor substrate; an isolation structure formed in a trench, formed in the semiconductor substrate, through a semiconductor oxide film; a floating gate formed on the semiconductor substrate between the isolation structures through an insulating film; a gate oxidation protection film formed on a side surface, on the isolation structure side, of the floating gate so that each of a part of a side surface and a bottom surface of the gate oxidation protection film contacts the insulating film; and a control gate formed on the floating gate through an inter-gate insulating film.

Claims

exact text as granted — not AI-modified
1 . A semiconductor device, comprising:
 a semiconductor substrate;   an isolation structure formed in a trench, formed in the semiconductor substrate, through a semiconductor oxide film;   a floating gate formed on the semiconductor substrate between the isolation structures through an insulating film;   a gate oxidation protection film formed on a side surface, on the isolation structure side, of the floating gate so that each of a part of a side surface and a bottom surface of the gate oxidation protection film contacts the insulating film; and   a control gate formed on the floating gate through an inter-gate insulating film.   
   
   
       2 . The semiconductor device according to  claim 1 , wherein the gate oxidation protection film includes at least one of a silicon oxide, a silicon nitride and a silicon oxynitride. 
   
   
       3 . The semiconductor device according to  claim 1 , wherein the isolation structure includes a silicon oxide. 
   
   
       4 . The semiconductor device according to  claim 1 , wherein the insulating film includes at least one of a silicon oxide and a silicon nitride. 
   
   
       5 . The semiconductor device according to  claim 1 , wherein the inter-gate insulating film includes at least one of a silicon oxide and a silicon nitride. 
   
   
       6 - 20 . (canceled)

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