Thermal module having enhanced heat-dissipating efficiency and heat dissipating system thereof

Abstract

A thermal module includes a conductive base disposed on a heat source for conducting heat generated by the heat source, and a plurality of thermal fins disposed substantially on the conductive base in parallel. A plurality of protruding portions is formed on each thermal fin in a direction whereto the thermal fins are stretched from the conductive base, and the protruding portions of adjacent thermal fins are arranged alternately in the direction whereto the thermal fins are stretched from the conductive base so as to dissipate the heat conducted to the conductive base from the heat source.

1 . A thermal module comprising:
 a conductive base disposed on a heat source for conducting heat generated by the heat source; and   a plurality of thermal fins substantially disposed on the conductive base in parallel, a plurality of protruding portions being formed on each thermal fin in a direction whereto the thermal fins are stretched from the conductive base, and the plurality of protruding portions on adjacent thermal fins being arranged alternately in the direction whereto the thermal fins are stretched from the conductive base so as to dissipate the heat conducted to the conductive base from the heat source.   
     
     
         2 . The thermal module of  claim 1 , wherein the plurality of thermal fins is made of metal material. 
     
     
         3 . The thermal module of  claim 2 , wherein the plurality of thermal fins is made of copper material or aluminum material. 
     
     
         4 . The thermal module of  claim 1 , wherein each thermal fin is a slice-shaped structure or a pillar-shaped structure. 
     
     
         5 . The thermal module of  claim 1 , wherein distances between surfaces of adjacent thermal fins are the same. 
     
     
         6 . The thermal module of  claim 1 , wherein each protruding portion is an arc-shaped structure, a triangle-shaped structure, or a sawtooth-shaped structure. 
     
     
         7 . The thermal module of  claim 1 , wherein each protruding portion is a long strip structure, and directions of the plurality of protruding portions are substantially parallel to the conductive base. 
     
     
         8 . The thermal module of  claim 1  further comprising:
 a fan disposed on a side of the plurality of thermal fins so as to dissipate the heat from the plurality of thermal fins.   
     
     
         9 . The thermal module of  claim 1 , wherein the plurality of thermal fins is glued or welded on the conductive base. 
     
     
         10 . The thermal module of  claim 1 , wherein the plurality of thermal fins is formed on the conductive base by cutting, molding, or stamping. 
     
     
         11 . A heat dissipating system comprising:
 a circuit board;   a heat source installed on the circuit board; and   a thermal module comprising:
 a conductive base disposed on the heat source for conducting heat generated by the heat source; and 
 a plurality of thermal fins substantially disposed on the conductive base in parallel, a plurality of protruding portions being formed on each thermal fin in a direction whereto the thermal fins are stretched from the conductive base, and the plurality of protruding portions on adjacent thermal fins being arranged alternately in the direction whereto the thermal fins are stretched from the conductive base so as to dissipate the heat conducted to the conductive base from the heat source. 
   
     
     
         12 . The heat dissipating system of  claim 11 , wherein the heat source is a central processing unit or a chip. 
     
     
         13 . The heat dissipating system of  claim 11 , wherein the plurality of thermal fins is made of metal material. 
     
     
         14 . The heat dissipating system of  claim 11 , wherein each thermal fin is a slice-shaped structure or a pillar-shaped structure. 
     
     
         15 . The heat dissipating system of  claim 11 , wherein distances between surfaces of adjacent thermal fins are the same. 
     
     
         16 . The heat dissipating system of  claim 11 , wherein each protruding portion is an arc-shaped structure, a triangle-shaped structure, or a sawtooth-shaped structure. 
     
     
         17 . The heat dissipating system of  claim 11 , wherein each protruding portion is a long strip structure, and directions of the plurality of protruding portions are substantially parallel to the conductive base. 
     
     
         18 . The heat dissipating system of  claim 11 , wherein the thermal module further comprises a fan disposed on a side of the plurality of thermal fins so as to dissipate the heat from the plurality of thermal fins. 
     
     
         19 . The heat dissipating system of  claim 11 , wherein the plurality of thermal fins is glued or welded on the conductive base. 
     
     
         20 . The heat dissipating system of  claim 11 , wherein the plurality of thermal fins is formed on the conductive base by cutting, molding, or stamping.