Stacked Mounting Structure and Method of Manufacturing Stacked Mounting Structure

Abstract

There is provided a stacked mounting structure in which, it is possible to realize a narrowing of pitch and to secure a height which enables to mount components to be mounted, and a method of manufacturing stacked mounting structure. The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.

1 . A stacked mounting structure comprising:
 a plurality of members provided with a mounting area, which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted; and   an electroconductive member which is disposed on the area for connections between the mutually facing members, wherein   a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.   
     
     
         2 . The stacked mounting structure according to  claim 1 , wherein a reinforcing member is installed around the electroconductive member. 
     
     
         3 . The stacked mounting structure according to  claim 1 , wherein
 the components to be mounted are mounted on the mounting area, and   a distance of the mounting area between the plurality of members is more than a height of the components to be mounted.   
     
     
         4 . The stacked mounting structure according to  claim 1 , wherein the reinforcing member is filled in the mounting area between the mutually facing members. 
     
     
         5 . The stacked mounting structure according to  claim 1 , wherein the electroconductive member is rod-shaped. 
     
     
         6 . The stacked mounting structure according to  claim 1 , wherein the electroconductive member, in a state of one end portion thereof joined, the other end portion is mounted on the member, and is formed by removing the portion joined after the other end portion is mounted on the member. 
     
     
         7 . The stacked mounting structure according to  claim 1 , wherein an electroconductive pattern of which, at least a part is electrically connected to the electroconductive member, is formed at one end portion of the reinforcing member. 
     
     
         8 . A method of manufacturing stacked mounting structure comprising steps of:
 mounting components to be mounted, and mounting an electroconductive member which is higher than a height of the components to be mounted, on a first member;   a reinforcing step of forming a reinforcing member around the electroconductive member on the first member by exposing an end portion of the electroconductive member, at an opposite side of the first member, wherein   at the reinforcing step, a surface of the reinforcing member, opposite to the first member is flattened by grinding, and an end portion of the electroconductive member is exposed.   
     
     
         9 . The method of manufacturing stacked mounting structure according to  claim 8 , comprising:
 forming a metal film on an end-portion surface of the electroconductive member which is exposed, after the reinforcing member is formed by exposing the end portion of the electroconductive member, on the opposite side of the first member; and   a step of forming a bump on the metal film of the end-portion surface of the electro conductive member.   
     
     
         10 . The method of manufacturing stacked mounting structure according to  claim 8 , further comprising:
 a joining step of forming one end portion of the electroconductive member, in a state of the plurality of electroconductive member joined.   
     
     
         11 . The method of manufacturing stacked mounting structure according to  claim 8 , comprising:
 a separating step after an insulating-material forming step, wherein   the first member has a size equivalent to a plurality of modules.