Electrically conductive composition for via-holes

Abstract

The present invention relates to an electrically conductive composition for filling via-holes formed in an electronic circuit substrate containing an electrically conductive metal and a vehicle, wherein the content of the electrically conductive metal is 57 vol % or more, and the composition is a plastic fluid for which fluidity increases when external pressure is applied to the composition.

1 . A method for production of electronic devise, comprising the steps of:
 preparing an electronic circuit substrate in which a through-hole is formed, wherein the area of the through-hole in a plane parallel to the plane of the substrate is at least 0.25 mm 2 ;   filling an electrically conductive composition comprising an electrically conductive metal and a vehicle into the through-hole, wherein the electrically conductive metal is 57 vol % or more, and wherein the electrically conductive composition is a plastic fluid for which fluidity increases when external pressure is applied the composition; and   firing the electronic circuit substrate filled with the electrically conductive composition.   
   
   
       2 . The method for production of an electronic devise according to  claim 1 , wherein the electrically conductive metal is a metal selected from the group consisting of gold, silver, copper, palladium, platinum, nickel, aluminum and an alloy thereof. 
   
   
       3 . The method for production of an electronic devise according to  claim 1 , wherein the electrically conductive metal is a spherical powder having mean particle diameter of 0.8 μm to 8 μm. 
   
   
       4 . The method for production of an electronic devise according to  claim 1 , wherein the electrically conductive metal is 57 vol % to 75 vol % based on the total weight of the composition. 
   
   
       5 . The method for production of an electronic devise according to  claim 4 , wherein the electrically conductive metal is 60 vol % to 72 vol % based on the total weight of the composition. 
   
   
       6 . The method for production of an electronic devise according to  claim 5 , wherein the electrically conductive metal is 63 vol % to 70 vol % based on the total weight of the composition. 
   
   
       7 . The method for production of an electronic devise according to  claim 1 , wherein the electrically conductive composition further comprises an inorganic oxide that does not melt at a temperature of 900° C. or lower selected from the group consisting of Al 2 O 3 , SiO 2 , TiO 2 , MnO, MgO, ZrO 2 , CaO, BaO and CO 2 O 3 , a compound oxide thereof, or a metal resinate at 0.1 wt % to 10 wt % based on the total weight of the composition. 
   
   
       8 . The method for production of an electronic devise according to  claim 7 , wherein the mean particle diameter of the inorganic oxide is 0.03 to 5 μm. 
   
   
       9 . The method for production of an electronic devise according to  claim 1 , wherein the electrically conductive composition further comprises glass powder at 0.1 wt % to 10 wt % based on the total weight of the composition. 
   
   
       10 . The method for production of an electronic devise according to  claim 9 , wherein the electrically conductive composition further comprises glass powder at 0.2 wt % to 5 wt % based on the total weight of the composition. 
   
   
       11 . The method for production of an electronic devise according to  claim 9 , wherein the mean particle diameter of the glass powder is 0.1 to 5 μm. 
   
   
       12 . The method for production of an electronic devise according to  claim 1 , the vehicle comprises a binder resin selected from the group consisting of an ethyl cellulose resin, acrylic resin, rosin-modified resin and polyvinyl butyral resin. 
   
   
       13 . The method for production of an electronic devise according to  claim 1 , wherein packing density of the electrically conductive composition in case of having dried the composition is 50% or more. 
   
   
       14 . An electronic device manufactured by the method of  claim 1 .