US2010200200A1PendingUtilityA1
Heat-transport device, method for manufacturing the same, and electronic device
Est. expiryDec 12, 2022(expired)· nominal 20-yr term from priority
H10W 40/73F28D 15/043F28D 15/02
44
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Claims
Abstract
A heat-transport device, which is suitable for reduction in volume and thickness, includes a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, wherein the surface of at least one of the wick and the line are subjected to coating treatment by ion implantation, thermal oxidation, or steam oxidation to prevent the generation of gas, particularly hydrogen.
Claims
exact text as granted — not AI-modified1 . A heat-transport device comprising:
a plurality of composite components, each comprising a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, the plurality of composite components being bonded, the surface of at least one of the wick and the line being subjected to coating treatment for preventing gas generation.
2 . A heat-transport device according to claim 1 , wherein the surface of at least one of the wick and the line is subjected to surface treatment by nitriding, oxidation, or carbonization.
3 . A heat-transport device according to claim 1 , wherein the pluralities of composite components are bonded by anodic bonding.
4 . A heat-transport device according to claim 1 , wherein the pluralities of composite components are bonded with a thermoplastic bonding sheet by thermal fusing.
5 . A heat-transport device according to claim 1 , wherein silicon and the glass constituting the pluralities of composite components are bonded to each other.
6 . A method for manufacturing a heat-transport device that includes a plurality of composite components, each comprising a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, the plurality of composite components being bonded, the method comprising:
subjecting the surface of at least one of the wick and the line to coating treatment for preventing gas generation.
7 . A method for manufacturing a heat-transport device according to claim 6 , wherein the surface of at least one of the wick and the line is subjected to surface treatment by nitriding, oxidation, or carbonization.
8 . A method for manufacturing a heat-transport device according to claim 6 , wherein the pluralities of composite components are bonded by anodic bonding.
9 . A method for manufacturing a heat-transport device according to claim 6 , wherein the pluralities of composite components are bonded with a thermoplastic bonding sheet by thermal fusing.
10 . An electronic device comprising a heat source having a heat-transport mechanism that includes a plurality of composite components, each comprising a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, the plurality of composite components being bonded,
wherein the surface of at least one of the wick and the line is subjected to coating treatment for preventing gas generation.Join the waitlist — get patent alerts
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