Fabricating process of circuit board with embedded passive component

Abstract

A process for fabricating a circuit board with an embedded passive component is provided. An electrode-patterned layer having electrodes is formed on a surface of a conductive layer. A passive component material is filled in the intervals between the electrodes. The conductive layer and the electrode-patterned layer are laminated to a dielectric layer, wherein the electrode-patterned layer is embedded in the dielectric layer. The conductive layer is patterned to form a circuit layer.

1 . A process for fabricating a circuit board with the embedded passive component, the process comprising:
 forming an electrode-patterned layer on a first surface of a conductive layer, wherein the electrode-patterned layer has a plurality of electrodes;   filling a passive component material in the intervals between the electrodes;   laminating the conductive layer and the electrode-patterned layer to a dielectric layer, wherein the electrode-patterned layer is embedded in the dielectric layer; and   patterning the conductive layer to form a first circuit layer.   
   
   
       2 . The process for fabricating the circuit board with the embedded passive component as claimed in  claim 1 , wherein the step of forming the electrode-patterned layer comprises:
 forming a patterned photoresist layer on the first surface of the conductive layer;   performing an electroplating process to form the electrode-patterned layer; and   removing the patterned photoresist layer.   
   
   
       3 . The process for fabricating the circuit board with the embedded passive component as claimed in  claim 1 , wherein the step of forming the first circuit layer comprises:
 forming a patterned photoresist layer on a second surface of the conductive layer;   performing an electroplating process to form the first circuit layer;   removing the patterned photoresist layer; and   removing a part of the conductive layer, such that the electrodes are electrically insulated.   
   
   
       4 . The process for fabricating the circuit board with the embedded passive component as claimed in  claim 1 , after forming the first circuit layer, further comprising:
 forming a patterned dielectric layer on the first circuit layer, wherein the patterned dielectric layer exposes a part of the first circuit layer; and   forming a second circuit layer on the patterned dielectric layer, wherein the second circuit layer is electrically connected to the first circuit layer.