Solder alloy, solder ball and solder joint using same

Abstract

Disclosed is a Pb-free solder alloy consisting of, in mass %, 0.1-1.5% of Ag, 0.5-0.75% of Cu, Ni in an amount satisfying 12.5≦Cu/Ni≦100, and the balance of Sn and unavoidable impurities. The solder alloy preferably contains, in mass %, 0.3-1.2% of Ag and 0.01-0.04% of Ni. Also disclosed is a solder ball obtained by spheroidizing the solder alloy. In addition, the solder alloy is suitable for a solder joint onto an Ni electrode. The solder alloy has excellent drop impact resistance, while being suppressed in decrease of joining strength under high temperature conditions for a long time.

1 . A solder alloy consisting of, by mass,
 0.1 to 1.5% Ag;   0.5 to 0.75% Cu;   Ni in an amount satisfying the equation of 12.5≦Cu/Ni≦100; and   the balance of Sn and unavoidable impurities.   
   
   
       2 . The solder alloy according to  claim 1 , wherein the solder alloy contains, by mass, 0.3 to 1.2% Ag. 
   
   
       3 . The solder alloy according to  claim 1 , wherein the solder alloy contains, by mass, 0.01 to 0.04% Ni. 
   
   
       4 . (canceled) 
   
   
       5 . (canceled) 
   
   
       6 . The solder alloy according to  claim 2 , wherein the solder alloy contains, by mass, 0.01 to 0.04% Ni. 
   
   
       7 . A solder ball formed from a solder alloy by spheroidizing, wherein the solder alloy consists of, by mass,
 0.1 to 1.5% Ag;   0.5 to 0.75% Cu;   Ni in an amount satisfying the equation of 12.5≦Cu/Ni≦100; and   the balance of Sn and unavoidable impurities.   
   
   
       8 . The solder ball of  claim 7 , wherein the solder alloy contains, by mass, 0.3 to 1.2% Ag. 
   
   
       9 . The solder ball of  claim 8 , wherein the solder alloy contains, by mass, 0.01 to 0.04% Ni. 
   
   
       10 . A solder joint wherein a solder alloy is bonded to a Ni electrode where the solder alloy consists of, by mass,
 0.1 to 1.5% Ag;   0.5 to 0.75% Cu;   Ni in an amount satisfying the equation of 12.5≦Cu/Ni≦100; and   the balance of Sn and unavoidable impurities.   
   
   
       11 . The solder joint of  claim 10 , wherein the solder alloy contains, by mass, 0.3 to 1.2% Ag. 
   
   
       12 . The solder joint of  claim 11 , wherein the solder alloy contains, by mass, 0.01 to 0.04% Ni.