Novel build-up package for integrated circuit devices, and methods of making same

Abstract

A device is disclosed which includes, in one illustrative example, an integrated circuit die having an active surface and a molded body extending around a perimeter of the die, the molded body having lips that are positioned above a portion of the active surface of the die. Another illustrative example includes an integrated circuit die having an active surface, a molded body extending around a perimeter of the die and a CTE buffer material formed around at least a portion of the perimeter of the die adjacent the active surface of the die, wherein the CTE buffer material is positioned between a portion of the die and a portion of the molded body and wherein the CTE buffer material has a coefficient of thermal expansion that is intermediate a coefficient of thermal expansion for the die and a coefficient of thermal expansion for the molded body.

1 . A device, comprising:
 an integrated circuit die having an active surface;   and a molded body extending around a perimeter of the die, the molded body having lips that are positioned above a portion of the active surface of the die.   
   
   
       2 . The device of  claim 1 , wherein the lips extend inward from the perimeter of the die. 
   
   
       3 . The device of  claim 2 , wherein the lips engage the active surface of the die. 
   
   
       4 . The device of  claim 1 , wherein an upper surface of the molded body is vertically spaced apart from the active surface of the die. 
   
   
       5 . The device of  claim 1 , further comprising a layer of material formed on the active surface of the die, and wherein the molded body has a thickness that is approximately the same as a combined thickness of the die and the layer of material. 
   
   
       6 . A device, comprising:
 an integrated circuit die having an active surface; and   a molded body extending around a perimeter of the die, a portion of the molded body being positioned above a portion of the active surface of the die such that the molded body defines a window that has a footprint that is smaller than a footprint of the active surface of the die.   
   
   
       7 . The device of  claim 6 , wherein the portions of the molded body above the active surface of the die engage the active surface of the die. 
   
   
       8 . The device of  claim 6 , wherein an upper surface of the molded body is vertically spaced apart from the active surface of the die. 
   
   
       9 . The device of  claim 6 , further comprising a layer of material formed on an active surface of the die, and wherein the molded body has a thickness that is approximately the same as a combined thickness of the die and the layer of material.