Loop heat pipe type heat transfer device

Abstract

It is an object of the invention to provide a loop heat pipe type heat transfer device that has reduced size, thickness and weight and exhibits high heat transfer performance. The loop heat pipe type heat transfer device is provided with an evaporator, a steam pipe that conducts a gas phase working fluid from the evaporator, a condenser connected to the steam pipe and a fluid pipe that circulates the liquid phase working fluid from the condenser to the evaporator, and is characterized in that a wick composed of a fiber structure laminate comprising a laminated nonwoven fabric is set inside the evaporator.

1 - 7 . (canceled) 
   
   
       8 . A loop heat pipe type heat transfer device provided with an evaporator, a steam pipe that conducts a gas phase working fluid from the evaporator, a condenser connected to the steam pipe and a fluid pipe that circulates the liquid phase working fluid from the condenser to the evaporator, the loop heat pipe type heat transfer device being characterized in that a wick composed of a fiber structure laminate comprising a laminated nonwoven fabric is set inside the evaporator. 
   
   
       9 . A loop heat pipe type heat transfer device according to  claim 8 , characterized in that the fiber structure laminate has a mean flow pore size of 0.1-30 μm. 
   
   
       10 . A loop heat pipe type heat transfer device according to  claim 8  or  9 , characterized in that the fiber structure laminate has a void percentage of 65-95% and a void index (void percentage (%)/mean flow pore size (μm)) of 10-1000. 
   
   
       11 . A loop heat pipe type heat transfer device according to  claim 8  or  9 , characterized in that the fiber structure laminate has a 10% flow pore size that is 0-20 μm larger than the mean flow pore size. 
   
   
       12 . A loop heat pipe type heat transfer device according to  claim 8  or  9 , characterized in that the nonwoven fabric of the fiber structure laminate is bonded in a laminated state, and the bonding area is 0.2-20% of a nonwoven fabric area, excluding the area bonded at the periphery of the wick for maintenance of the airtightness of the evaporator. 
   
   
       13 . A loop heat pipe type heat transfer device according to  claim 8  or  9 , characterized in that the fiber structure laminate comprises at least two different laminated nonwoven fabrics with different void indexes (void percentage (%)/mean flow pore size (μm)). 
   
   
       14 . A loop heat pipe type heat transfer device according to  claim 12 , characterized in that some of the bonded sections of the fiber structure laminate in the evaporator are used as sections of the structure that maintain the airtightness of the evaporator.