Heat-Dissipating Fin, Heat-Dissipating Device, And Method For Enhancing Heat Dissipation Effect Of A Heat-Dissipating Fin

Abstract

In a method for enhancing heat dissipation effect of a heat-dissipating fin, a plurality of heat-conducting particles are affixed directly and contactingly to a part of a surface of the heat-dissipating fin to increase the surface area of the heat-dissipating fin so as to reduce thermal boundary layer effect. A heat-dissipating fin and a heat-dissipating device including a plurality of the heat-dissipating fins are also provided.

1 . A method for enhancing heat dissipation effect of a heat-dissipating fin, comprising affixing directly and contactingly a plurality of heat-conducting particles to apart of a surface of the heat-dissipating fin. 
     
     
         2 . The method for enhancing heat dissipation effect of a heat-dissipating fin of  claim 1 , wherein the heat-dissipating fin and the heat-conducting particles are formed from a metal material. 
     
     
         3 . The method for enhancing heat dissipation effect of a heat-dissipating fin of  claim 2 , wherein the heat-conducting particles are one of copper powder particles and aluminum powder particles. 
     
     
         4 . The method for enhancing heat dissipation effect of a heat-dissipating fin of  claim 3 , wherein the heat-conducting particles are affixed to the surface of the heat-dissipating fin using one of a sand-blasting technique and a sintering technique. 
     
     
         5 . The method for enhancing heat dissipation effect of a heat-dissipating fin of  claim 4 , wherein, when said method is for enhancing heat dissipation of more than one heat-dissipating fin, heat-conducting particles with a particle diameter not larger than one-tenth of a distance between each adjacent pair of the heat-dissipating fins are selected for affixing to the surfaces of the heat-dissipating fins. 
     
     
         6 . The method for enhancing heat dissipation effect of a heat-dissipating fin of  claim 5 , wherein the heat-conducting particles have a particle diameter ranging between 10 −4  m and 10 −6  m. 
     
     
         7 . The method for enhancing heat dissipation effect of a heat-dissipating fin of  claim 6 , wherein the heat-conducting particles have a particle diameter ranging between 10 −5  m and 10 −6  m. 
     
     
         8 . The method for enhancing heat dissipation effect of a heat-dissipating fin of  claim 1 , wherein the heat-conducting particles are affixed to the entire surface of the heat-dissipating fin. 
     
     
         9 . A heat-dissipating fin, comprising a fin body and a plurality of heat-conducting particles affixed to a part of a surface of said fin body. 
     
     
         10 . The heat-dissipating fin of  claim 9 , wherein said fin body and said heat-conducting particles are formed from metal, each of said heat-conducting particles having a surface partially in direct contact with said surface of said fin body. 
     
     
         11 . The heat-dissipating fin of  claim 10 , wherein said heat-conducting particles are one of copper powder particles and aluminum powder particles. 
     
     
         12 . The heat-dissipating fin of  claim 11 , wherein said heat-conducting particles have a particle diameter ranging between 10 −4  m and 10 −6  m. 
     
     
         13 . The heat-dissipating fin of  claim 12 , wherein said heat-conducting particles have a particle diameter ranging between 10 −5  m and 10 −6  m. 
     
     
         14 . The heat-dissipating fin of  claim 9 , wherein said heat-conducting particles are affixed to the entire surface of said fin body. 
     
     
         15 . A heat-dissipating device, comprising a plurality of heat-dissipating fins, wherein at least one of said heat-dissipating fins has a surface, at least a part of which is provided with a plurality of heat-conducting particles. 
     
     
         16 . The heat-dissipating device of  claim 15 , wherein said heat-dissipating fins and said heat-conducting particles are formed from metal, each of said heat-conducting particles on said at least one heat-dissipating fin having a surface that is partially in direct contact with said surface of said at least one heat-dissipating fin. 
     
     
         17 . The heat-dissipating device of  claim 16 , wherein said heat-conducting particles are one of copper powder particles and aluminum powder particles. 
     
     
         18 . The heat-dissipating device of  claim 17 , wherein said heat-conducting particles have a particle diameter not larger than one-tenth of a distance between said at least one of said heat-dissipating fins and an adjacent one of said heat-dissipating fins. 
     
     
         19 . The heat-dissipating device of  claim 18 , wherein said heat-conducting particles have a particle diameter ranging between 10 −4  m and 10 −6  m. 
     
     
         20 . The heat-dissipating device of  claim 19 , wherein said heat-conducting particles have a particle diameter ranging between 10 −5  m and 10 −6  m. 
     
     
         21 . The heat-dissipating device of  claim 15 , wherein said heat-conducting particles are affixed to the entire surface of said at least one of said heat-dissipating fins.