Heat dissipation module

Abstract

A heat dissipation module includes a first substrate, a second substrate spaced from the first substrate, a heat pipe and three resilient flakes, i.e., a first resilient flake, a second resilient flake and a third resilient flake. The heat pipe connects with the first and second substrates. The first resilient flake forms a securing portion connecting with the first substrate and a locking portion extending outwardly beyond an outer edge of the first substrate. The second resilient flake forms a securing portion connecting with the second substrate and a locking portion extending outwardly beyond an outer edge of the second substrate. The third resilient flake includes a locking portion located at a middle and two securing portion at two opposite ends thereof. The two securing portions of the third resilient flake connect with the first and second substrates, respectively.

1 . A heat dissipation module, comprising:
 a first substrate and a second substrate being spaced from each other;   a heat pipe thermally connecting with the first substrate and the second substrate;   a first resilient flake forming a securing portion connecting with the first substrate and a locking portion extending outwardly beyond an outer edge of the first substrate;   a second resilient flake forming a securing portion connecting with the second substrate and a locking portion extending outwardly beyond an outer edge of the second substrate; and   a third resilient flake comprising a locking portion being located at a middle thereof and two securing portions at two opposite ends thereof, the two securing portions of the third resilient flake connecting with the first and second substrates, respectively.   
   
   
       2 . The heat dissipation module of  claim 1 , wherein the heat pipe includes a condenser section and an opposite evaporator section connecting with the first and second substrates, two of the three resilient flakes are located at two opposite lateral sides of the evaporator section of the heat pipe. 
   
   
       3 . The heat dissipation module of  claim 2 , wherein the first resilient flake is located at one lateral side of the evaporator section of the heat pipe, while the second resilient flake is located at an opposite lateral side of the evaporator section of the heat pipe. 
   
   
       4 . The heat dissipation module of  claim 3 , wherein the first and second substrates are substantially rectangular, the evaporator section of the heat pipe is located on top surfaces of the first and the second substrates adjacent to sides of the first and second substrates. 
   
   
       5 . The heat dissipation module of  claim 1 , wherein the third resilient flake forms an arched portion between each of the securing portions and the locking portion, the arched portion connects one end of the locking portion with a corresponding securing portion of the third resilient flake. 
   
   
       6 . The heat dissipation module of  claim 5 , wherein the locking portion and the securing portions of the third resilient flake are coplanar and collinear, the arched portions protrude upwardly with respect to the securing portions and the locking portion of the third resilient flake. 
   
   
       7 . The heat dissipation module of  claim 1 , wherein the first and second substrates are in parallel with each other. 
   
   
       8 . The heat dissipation module of  claim 7 , wherein the third resilient flake is located at a front side of the first and second substrates, and the first and second resilient flakes are located at rear sides of the first and second substrates, respectively. 
   
   
       9 . The heat dissipation module of  claim 8 , wherein the third resilient flake forms two arched portions each connecting one end of the locking portion to a corresponding securing portion of the third resilient flake. 
   
   
       10 . A heat dissipation module, comprising:
 a first substrate and a second substrate being spaced from each other;   a fin unit;   a heat pipe forming an evaporator section connecting with the first substrate and the second substrate, and a condenser section connecting with the fin unit;   a first resilient flake forming a securing portion connecting with the first substrate and a locking portion extending outwardly beyond an outer edge of the first substrate;   a second resilient flake forming a securing portion connecting with the second substrate and a locking portion extending outwardly beyond an outer edge of the second substrate; and   a third resilient flake comprising a locking portion being located at a middle thereof and two securing portions at two opposite ends thereof, the two securing portions of the third resilient flake connecting with the first and second substrates, respectively.   
   
   
       11 . The heat dissipation module of  claim 10 , wherein the first resilient flake is located at one lateral side of the evaporator section of the heat pipe, while the second resilient flake is located at an opposite lateral side of the evaporator section of the heat pipe. 
   
   
       12 . The heat dissipation module of  claim 11 , wherein the first and second substrates are substantially rectangular, the evaporator section of the heat pipe is located on top surfaces of the first and the second substrates adjacent to sides of the first and second substrates. 
   
   
       13 . The heat dissipation module of  claim 10 , wherein the third resilient flake forms two arched portions each connecting one end of the locking portion to a corresponding securing portion of the third resilient flake.