US2010180818A1PendingUtilityA1

Dynamic Film Thickness Control System/Method and its Utilization

Assignee: LING KOW-JEPriority: Oct 26, 2001Filed: Sep 17, 2008Published: Jul 22, 2010
Est. expiryOct 26, 2021(expired)· nominal 20-yr term from priority
G01B 11/0683C23C 14/042C23C 14/044C23C 14/24C23C 14/30C23C 14/3464C23C 14/546C23C 14/547
42
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Claims

Abstract

A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed.

Claims

exact text as granted — not AI-modified
1 . A dynamic film thickness control system comprising a mask plate and a film thickness control device; the mask plate being situated between a substrate and a vapor source and the film thickness control device being placed at an appropriate position; the utilization of the film thickness control device providing for real-time control over a coated film thickness and gradually moves the mask plate according to a film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the substrate to achieve the film thickness of a design objective, wherein the substrate being cylindrical or approximately cylindrical in shape and rotated on a center axis, the mask plate and the vapor source being situated at an exterior side of the substrate; the vapor source is positioned on an anchoring mount; the film thickness control device comprising a light source and a detector or an optical fiber; the light source being attached to an opposite side of the anchoring mount and the detector and/or optical fiber is placed at an interior side of the substrate at a position that is aligned with the light source. 
   
   
       2 . The dynamic film thickness control system as claimed in  claim 1  wherein the anchoring mount is fastened to a track and at least one of said vapor source is fixed onto an upper extent of the anchoring mount.

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