Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

1 . A cantilever probe for making contact with an electronic circuit element, comprising:
 at least one pivot element which is bonded to a substrate;   at least one beam element having a first distal end and a second distal end, wherein the second distal end holds a contact tip for making contact to an electronic circuit element, and wherein the at least one beam element contacts the pivot element at a location intermediate to the first and second distal ends;   a compliant element that functionally connects the substrate to the beam element on a lateral side of the beam element that is opposite to the lateral side of the beam, relative to the pivot element, that holds the contact tip;   wherein the compliant element extends in length and experiences a net tension force as the contact tip is pressed against a target surface.   
   
   
       2 . A cantilever probe for making contact with an electronic circuit element, comprising:
 at least one pivot element which is bonded to a substrate;   at least one beam element having a contact tip attached thereto and positioned to pivot about the pivot element;   a compliant element that functionally connects the substrate to the beam element on a same lateral side of the beam element, relative to the pivot element, which holds the contact tip;   wherein the compliant element experiences decreases in length and experiences a net compressive force as the contact tip is pressed against a target surface.   
   
   
       3 . The cantilever probe of  claim 1  configured into an array of probes, wherein a plurality of probes of the array of probes additionally comprise bases configured to be slid into mounts located on a substrate. 
   
   
       4 . The array of probes of  claim 3  mounted to a substrate which comprises a plurality of mounts that that are raised above a surface of the substrate. 
   
   
       5 . The array of probes of  claim 3  mounted to a substrate which comprises a plurality of mounts that that are raised above a surface of the substrate. 
   
   
       6 . The cantilever probe of  claim 1  wherein the probe is bonded to a pad on a surface of the substrate 
   
   
       7 . The cantilever probe of  claim 1  wherein the tip of the probe is formed from a different material than used in forming at least one of the beam of the compliant element of the probe. 
   
   
       8 . The cantilever probe of  claim 1  wherein the beam portion narrows with distance from the pivot element. 
   
   
       9 . The cantilever probe of  claim 1  wherein the pivot element has a contact portion which has a curved shape whereby the contact region between the pivot element and beam portion is reduced. 
   
   
       10 . The cantilever probe of  claim 1  wherein the pivot element has a contact portion which has a pointed shape whereby the contact region between the pivot element and beam portion is reduced. 
   
   
       11 . The cantilever probe of  claim 1  wherein the pivot element and the beam portion are joined together in a manner that allows rotation.