Electroplating solution for manufacturing nanometer platinum and platinum based alloy particles and method thereof

Abstract

The present invention generally relates to an electroplating solution for manufacturing nanometer platinum and platinum based alloy particles and a method thereof. That is, an acid solution having platinum complex compound and citric acid is provided into a reaction tank to be as an electroplating solution, then a plurality of platinum and platinum based alloy particles are deposited on the surfaces of electrodes under the condition of applying negative potentials. The acid solution is capable of effectively providing the rate of conducting ions. The citric acid can effectively promote the dispersity of the platinum and platinum based alloy particles and reduce the dimensions the platinum and platinum based alloy particles.

1 . An electroplating solution for manufacturing nanometer platinum and platinum based alloy particles comprising:
 a solution having a platinum metal complex compound; and   an acid solution having citric acid;   wherein an electroplating process can be progressed while the electroplating solution achieves a certain temperature.   
   
   
       2 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 1 , wherein the concentration of the platinum metal complex compound in the electroplating solution is between 0.1 micron molarity (0.1×10 −6  M) and 100 molarity (M). 
   
   
       3 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 1  further comprising a non-platinum metal complex compound, which comprises one of the group consisting of: the elements of the group B in the periodic table, Bismuth, Magnesium, Iridium, and Tin. 
   
   
       4 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 3 , wherein the concentration of the non-platinum metal complex compound in the electroplating solution is between 0.1 micron molarity (0.1×10 −6  M) and 100 molarity (M). 
   
   
       5 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 1 , wherein the concentration of the citric acid in the electroplating solution is between 0.01 molarity (M) and 5 molarity (M). 
   
   
       6 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 1 , wherein the certain temperature of the electroplating solution is between 18° C. and 60° C. . 
   
   
       7 . An electroplating solution for manufacturing nanometer platinum and platinum based alloy particles comprising:
 a solution having a platinum metal complex compound; and   an acid solution having citric acid and lactic acid;   wherein an electroplating process can be progressed while the electroplating solution achieves a certain temperature.   
   
   
       8 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 7 , wherein the concentration of the platinum metal complex compound in the electroplating solution is between 0.1 micron molarity (0.1×10 −6  M) and 100 molarity (M). 
   
   
       9 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 7  further comprising a non-platinum metal complex compound, which comprises one of the group consisting of: the elements of the group B in the periodic table, bismuth, magnesium, iridium, and tin. 
   
   
       10 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 9 , wherein the concentration of the non-platinum metal complex compound in the electroplating solution is between 0.1 micron molarity (0.1×10 −6  M) and 100 molarity. 
   
   
       11 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 7 , wherein the concentration of the citric acid in the electroplating solution is between 0.01 molarity (M) and 5 molarity (M). 
   
   
       12 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 7 , wherein the concentration of the lactic acid in the electroplating solution is between 0.005 molarity (M) and 10 molarity (M). 
   
   
       13 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 7 , wherein the certain temperature of the electroplating solution is between 18° C. and 60° C. . 
   
   
       14 . An electroplating solution for manufacturing nanometer platinum and platinum based alloy particles comprising:
 a solution having a platinum metal complex compound; and   an acid solution having citric acid and boric acid;   wherein an electroplating process can be progressed while the electroplating solution achieves a certain temperature.   
   
   
       15 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 14 , wherein the concentration of the platinum metal complex compound in the electroplating solution is between 0.1 micron molarity (0.1×10 −6  M) and 100 molarity (M). 
   
   
       16 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 14  further comprising a non-platinum metal complex compound, which comprises one of the group consisting of: the elements of the group B in the periodic table, Bismuth, Magnesium, Iridium, and Tin. 
   
   
       17 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 16 , wherein the concentration of the non-platinum metal complex compound in the electroplating solution is between 0.1 micron molarity (0.1×10 −6  M) and 100 molarity (M). 
   
   
       18 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 14 , wherein the concentration of the citric acid in the electroplating solution is between 0.01 molarity (M) and 5 molarity (M). 
   
   
       19 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 14 , wherein the concentration of the boric acid in the electroplating solution is between 0.005 molarity (M) and 10 molarity (M). 
   
   
       20 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 14 , wherein the certain temperature of the electroplating solution is between 18° C. and 60° C. . 
   
   
       21 . An electroplating solution for manufacturing nanometer platinum and platinum based alloy particles comprising:
 a solution having a platinum metal complex compound; and   an acid solution having citric acid and sulfuric acid;   wherein an electroplating process can be progressed while the electroplating solution achieves a certain temperature.   
   
   
       22 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 21 , wherein the concentration of the platinum metal complex compound in the electroplating solution is between 0.1 micron molarity (0.1×10 −6  M) and 100 molarity (M). 
   
   
       23 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 21  further comprising a non-platinum metal complex compound, which comprises one of the group consisting of: the elements of the group B in the periodic table, Bismuth, Magnesium, Iridium, and Tin. 
   
   
       24 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 23 , wherein the concentration of the non-platinum metal complex compound in the electroplating solution is between 0.1 micron molarity (0.1×10 −6  M) and 100 molarity (M). 
   
   
       25 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 21 , wherein the concentration of the citric acid in the electroplating solution is between 0.01 molarity (M) and 5 molarity (M). 
   
   
       26 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 21 , wherein the concentration of the sulfuric acid in the electroplating solution is between 0.005 molarity (M) and 10 molarity (M). 
   
   
       27 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 21 , wherein the certain temperature of the electroplating solution is between 18° C. and 60° C. 
   
   
       28 . An electroplating solution for manufacturing nanometer platinum and platinum based alloy particles comprising:
 a solution having a platinum metal complex compound; and   an acid solution having citric acid and glycol;   wherein an electroplating process can be progressed while the electroplating solution achieves a certain temperature.   
   
   
       29 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 28 , wherein the concentration of the platinum metal complex compound in the electroplating solution is between 0.1 micron molarity (0.1×10 −6  M) and 100 molarity (M). 
   
   
       30 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 28  further comprising a non-platinum metal complex compound, which comprises one of the group consisting of: the elements of the group B in the periodic table, Bismuth, Magnesium, Iridium, and Tin. 
   
   
       31 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 30 , wherein the concentration of the non-platinum metal complex compound in the electroplating solution is between 0.1 micron molarity (0.1×10 −6  M) and 100 molarity (M). 
   
   
       32 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 28 , wherein the concentration of the citric acid in the electroplating solution is between 0.01 molarity (M) and 5 molarity (M). 
   
   
       33 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 28 , wherein the concentration of the glycol in the electroplating solution is between 0.005 molarity (M) and 10 molarity (M). 
   
   
       34 . The electroplating solution for manufacturing the nanometer platinum and platinum based alloy particles according to  claim 28 , wherein the certain temperature of the electroplating solution is between 18° C. and 60° C. 
   
   
       35 . A method for manufacturing nanometer platinum and platinum based alloy particles comprising the steps of:
 (1) formulating an electroplating solution having at least a solution with a platinum metal complex compound and at least an acid solution with citric acid, and then enabling the electroplating solution to achieve a certain temperature;   (2) loading the formulated electroplating solution into a reaction tank, selecting a conductive member/semi-conductive member to be as a cathode, which is a working electrode, and a platinum metal to be as an anode, which is a counter electrode;   (3) disposing a reference electrode into the reaction tank; and   (4) applying a potential to the cathode for a certain period of time in order to manufacture the nanometer platinum and platinum based alloy particles.   
   
   
       36 . The method for manufacturing nanometer platinum and platinum based alloy particles according to  claim 35 , wherein the electroplating solution of step (1) achieves a temperature between 18° C. and 60° C. . 
   
   
       37 . The method for manufacturing nanometer platinum and platinum based alloy particles according to  claim 35 , wherein the reference electrode of step (3) is selected from the group consisting of: saturated calomel electrode, silver/chloride electrode and standard hydrogen electrode. 
   
   
       38 . The method for manufacturing nanometer platinum and platinum based alloy particles according to  claim 35 , wherein the potential of step (4) is selected from the group consisting of: pulsed DC and non-pulsed DC. 
   
   
       39 . The method for manufacturing nanometer platinum and platinum based alloy particles according to  claim 38 , wherein the potential range of the pulsed DC is between 1 V SHE  and −2 V SHE , the frequency range of the pulsed DC is between 0.1 Hz and 1000 Hz, wherein the potential range of the pulsed DC is equivalent to the standard hydrogen electrode potential. 
   
   
       40 . The method for manufacturing nanometer platinum and platinum based alloy particles according to  claim 38 , wherein the potential range of the non-pulsed DC is between 0.0 V SHE  and −2 V SHE , wherein the potential range of the non-pulsed DC is equivalent to the standard hydrogen electrode potential. 
   
   
       41 . The method for manufacturing nanometer platinum and platinum based alloy particles according to  claim 35 , wherein the time period of applying the potential of step (5) is between 1 ms and 24 hours.