Heat dissipating structure and method of manufacturing same

Abstract

A heat dissipating structure and a method of manufacturing same is disclosed. The heat dissipating structure includes a base being formed on one face with lower pipe-receiving grooves, a cover being formed on one face facing to the base with upper pipe-receiving grooves, and heat pipes disposed between the base and the cover. A heat-conducting substance is applied in the lower and upper pipe-receiving grooves, whereby when the cover is tightly pushed against the base, the heat pipes are tightly fitted in and between the lower and the upper pipe-receiving grooves. Radiating fins can be provided on the cover. When the base is attached at another face to an electronic device, heat produced by the electronic device can be effectively transferred to and dissipated from the heat dissipating structure, which has tightly connected base, heat pipes, and cover to ensure high heat dissipating effect without the need of tin soldering.

1 . A heat dissipating structure, comprising:
 a base being formed with at least one lower pipe-receiving groove;   a plurality of heat pipes being disposed in the at least one lower pipe-receiving groove, and a heat-conducting substance being applied between the at least one lower pipe-receiving groove and the heat pipes; and   a cover being formed with at least one upper pipe-receiving groove for engaging with the heat pipes; and a heat-conducting substance being applied between the at least one upper pipe-receiving groove and the heat pipes; and   wherein, the cover is tightly closed and connected to the base.   
   
   
       2 . The heat dissipating structure as claimed in  claim 1 , further comprising a plurality of radiating fins provided on the cover. 
   
   
       3 . The heat dissipating structure as claimed in  claim 1 , wherein the heat-conducting substance can be any one of a heat-conducting paste, a heat-conducting gel, and other types of thermal paste. 
   
   
       4 . A method of manufacturing a heat-dissipating structure, comprising the following steps:
 positioning a plurality of heat pipes in lower pipe-receiving grooves formed on a base;   closing a cover onto the heat pipes, so that upper pipe-receiving grooves correspondingly formed on the cover are engaged with the heat pipes;   applying a heat-conducting substance between the heat pipes and the base and between the heat pipes and the cover; and   pushing the cover against the base for them to tightly connect to each other and thereby fixedly hold the heat pipes therebetween.   
   
   
       5 . The method of manufacturing a heat-dissipating structure as claimed in  claim 4 , wherein the heat-conducting substance can be any of a heat-conducting paste, a heat-conducting gel, and any other type of thermal paste. 
   
   
       6 . A method of manufacturing a heat-dissipating structure, comprising the following steps:
 applying a heat-conducting substance in lower pipe-receiving grooves formed on a base;   positioning a plurality of heat pipes in the lower pipe-receiving grooves on the base;   applying a heat-conducting substance in upper pipe-receiving grooves formed on a cover;   closing the cover onto the heat pipes with the upper pipe-receiving grooves engaging with the heat pipes; and   pushing the cover against the base for them to tightly connect to each other and thereby fixedly hold the heat pipes therebetween.   
   
   
       7 . The method of manufacturing a heat-dissipating structure as claimed in  claim 6 , wherein the heat-conducting substance can be any one of a heat-conducting paste, a heat-conducting gel, and any other type of thermal paste.