US2010173567A1PendingUtilityA1

Methods and Devices for Enhancing Chemical Mechanical Polishing Processes

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Assignee: SUNG CHIEN-MINPriority: Feb 6, 2006Filed: Dec 31, 2009Published: Jul 8, 2010
Est. expiryFeb 6, 2026(expired)· nominal 20-yr term from priority
Inventors:Chien-Min Sung
B24B 37/105B24B 37/042
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Claims

Abstract

The present invention discloses methods and systems for increasing polishing performance of a CMP process. In one aspect, for example, a method of increasing polishing performance of a CMP process includes vibrating a contact interface between a CMP pad and a wafer during a CMP process, such that oscillations between the CMP pad and the wafer occurs in a direction substantially parallel to a working surface of the CMP pad. In one specific aspect, vibrating the contact interface includes vibrating the contact interface in a direction substantially parallel to the contact interface. The vibrating can include vibrating the CMP pad, vibrating the wafer, or vibrating the CMP pad and the wafer. Such vibrations can allow the contact pressure at the contact interface to be decreased as compared to a contact interface that is not vibrated to minimize damage to the CMP pad or the wafer.

Claims

exact text as granted — not AI-modified
1 . A method of increasing polishing performance of a CMP process, comprising:
 vibrating a contact interface between a CMP pad and a wafer during a CMP process, such that oscillations between the CMP pad and the wafer occur in a direction substantially parallel to a working surface of the CMP pad.   
     
     
         2 . The method of  claim 1 , wherein vibrating the contact interface includes vibrating the contact interface in a direction substantially parallel to the contact interface. 
     
     
         3 . The method of  claim 1 , wherein vibrating the contact interface includes vibrating the CMP pad. 
     
     
         4 . The method of  claim 1 , wherein vibrating the contact interface includes vibrating the wafer. 
     
     
         5 . The method of  claim 1 , wherein vibrating the contact interface includes vibrating the CMP pad and the wafer. 
     
     
         6 . The method of  claim 1 , further comprising decreasing contact pressure at the contact interface as compared to a contact interface that is not vibrated to minimize damage to the CMP pad or the wafer. 
     
     
         7 . The method of  claim 1 , wherein vibrations at the contact interface include a member selected from the group consisting of lateral motions, circular motions, elliptical motions, random motions, and combinations thereof. 
     
     
         8 . The method of  claim 1 , further comprising varying vibration frequency of the vibrating contact interface. 
     
     
         9 . The method of  claim 1 , further comprising varying vibration amplitude of the vibrating contact interface. 
     
     
         10 . The method of  claim 1 , wherein the contact surface is vibrated at an ultrasonic frequency greater than about 15 kHz. 
     
     
         11 . The method of  claim 1 , wherein the vibrating is continuous vibration. 
     
     
         12 . The method of  claim 1 , wherein the vibrating is intermittent vibration. 
     
     
         13 . The method of  claim 1 , wherein the vibrating is two or more superimposed vibrations. 
     
     
         14 . A CMP system, comprising:
 a CMP pad;   a wafer positioned to contact the CMP pad during a polishing procedure at a contact interface; and   a vibration system functionally coupled to at least one of the CMP pad and the wafer, the vibration system operable to cause vibrations at the contact interface in a direction substantially parallel to the contact interface.   
     
     
         15 . The system of  claim 14 , wherein the vibration system includes at least one ultrasonic transducer. 
     
     
         16 . The system of  claim 14 , further comprising a CMP pad mounting system for receiving the CMP pad, wherein the vibration system is coupled to the CMP pad mounting system. 
     
     
         17 . The system of  claim 14 , further comprising a wafer mounting system for receiving the wafer, wherein the vibration system is coupled to the wafer mounting system. 
     
     
         18 . A method of CMP processing, comprising:
 bringing into contact a CMP pad and a wafer;   moving the CMP pad and the wafer relative to one another to perform a CMP process; and   vibrating at least one of the CMP pad and the wafer such that oscillations between the CMP pad and the wafer occur in a direction substantially parallel to a working surface of the CMP pad.   
     
     
         19 . The method of  claim 18 , comprising vibrating the CMP pad. 
     
     
         20 . The method of  claim 18 , comprising vibrating the wafer.

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