Method of manufacturing capacitor-embedded low temperature co-fired ceramic substrate

Abstract

A method of manufacturing a capacitor-embedded low temperature co-fired ceramic substrate. A capacitor part is manufactured by firing a deposition including at least one high dielectric ceramic sheet to form a capacitor part. A plurality of low temperature co-fired green sheets are provided. Each of the low temperature co-fired green sheet has at least one of a conductive pattern and a conductive via hole thereon. A low temperature co-fired ceramic deposition is formed by depositing the low temperature co-fired green sheets to embed the capacitor part in the low temperature co-fired ceramic deposition. The embedded capacitor part is connected either to the conductive pattern or the conductive via hole of an adjacent green sheet. Then the low temperature co-fired ceramic deposition having the capacitor part embedded therein is fired.

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       25 . A capacitor-embedded low temperature co-fired ceramic substrate by a procedure, the procedure comprising:
 manufacturing a capacitor part by firing a deposition including at least one high dielectric ceramic sheet to form a capacitor part;   providing a plurality of low temperature co-fired green sheets each having at least one of a conductive pattern and a conductive via hole thereon;   forming a low temperature co-fired ceramic deposition by depositing the low temperature co-fired green sheets to embed the capacitor part in the low temperature co-fired ceramic deposition, the embedded capacitor part connected to the one of conductive pattern and conductive via hole of an adjacent one of the green sheets; and   firing the low temperature co-fired ceramic deposition having the capacitor part embedded therein,   wherein the capacitor part comprises at least one deposited capacitor block including a plurality of dielectric layers and first and second internal electrodes formed on top and bottom surfaces of the dielectric layers, respectively, and   the forming the low temperature co-fired ceramic deposition comprises:   punching some of the low temperature co-fired green sheets to form at least one cavity inside the low temperature co-fired ceramic deposition;   depositing the low temperature co-fired green sheets; and   mounting the deposited capacitor block on the cavity in the depositing process, and   wherein the cavity has a depth greater than a depth of the deposited capacitor block mounted thereon, considering a contraction degree of the low temperature co-fired green sheets during the firing.