Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module

Abstract

In the specification and drawing a display module is disclosed. The display module comprises a backboard, a display component and a printed circuit board with at least one locating pin formed thereon. The backboard has at least one locating hole. The display component is disposed on the backboard. The at least one the locating pin is inserted in the locating hole. Moreover, a method for manufacturing the printed circuit board and a method for fabricating the display module are also disclosed in the specification and drawing.

1 . A method for manufacturing a printed circuit board, comprising:
 providing a basic board having an upper surface and a bottom surface opposite to the upper surface;   providing a plurality of the electronic components temporarily disposed on the basic board;   providing at least one locating pin temporarily disposed on a place of the basic board, wherein the electronic components aren't temporarily disposed on the place; and   using surface mount technology simultaneously to joint at least one locating pin and the electronic components on the basic board.   
   
   
       2 . The method as claimed in  claim 1 , wherein providing the at least one locating pin comprises:
 providing a first locating pin and a second locating pin temporarily disposed on the upper surface.   
   
   
       3 . The method as claimed in  claim 2 , wherein the first locating pin is temporarily disposed near a corner of the upper surface, and the second locating pin is temporarily disposed near a diagonal corner opposite to the corner. 
   
   
       4 . The method as claimed in  claim 1 , wherein the electronic components and the at least one locating pin are temporarily disposed on the upper surface. 
   
   
       5 . The method as claimed in  claim 1 , wherein the at least one locating pin is temporarily disposed on the upper surface of the basic board, and the electronic components are temporarily disposed on the bottom surface. 
   
   
       6 . The method as claimed in  claim 1 , wherein a portion of the electronic components and the at least one locating pin are temporarily disposed on the upper surface, and the other portion of the electronic components are temporarily disposed on the bottom surface. 
   
   
       7 . A display module, comprising:
 a backboard having at least one locating hole;   a display component disposed on the backboard; and   a printed circuit board with at least one locating pin formed thereon, wherein the at least one locating pin is inserted in the at least one locating hole.   
   
   
       8 . The display module as claimed in  claim 7 , wherein the printed circuit board has an upper surface and a bottom surface, wherein the at least one locating pin is formed on the upper surface, the upper surface faces the backboard, and the bottom surface faces away from the backboard. 
   
   
       9 . The display module as claimed in  claim 7 , wherein the at least one locating pin comprise a first locating pin and a second locating pin, wherein an end of the first locating pin and an end of the second locating pin are soldered on the upper surface. 
   
   
       10 . The display module as claimed in  claim 9 , wherein the first locating pin is soldered near a corner of the upper surface, and the second locating pin is soldered near a diagonal corner opposite to the corner. 
   
   
       11 . The display module as claimed in  claim 7 , further comprising:
 a plurality of the electronic components soldered on the printed circuit board.   
   
   
       12 . The display module as claimed in  claim 11 , wherein the electronic components and the at least one locating pin are soldered on an upper surface of the printed circuit board. 
   
   
       13 . The display module as claimed in  claim 11 , wherein the at least one locating pin are soldered on an upper surface of the printed circuit board, and the electronic components are soldered on a bottom surface of the printed circuit board. 
   
   
       14 . The display module as claimed in  claim 11 , wherein a portion of the electronic components and the at least one locating pin are soldered on an upper surface of the printed circuit board, and the other portion of the electronic components are soldered on a bottom surface of the printed circuit board. 
   
   
       15 . The display module as claimed in  claim 7 , further comprising:
 a shield plate disposed on the backboard for covering the printed circuit board.   
   
   
       16 . A method for fabricating a display module, comprising:
 providing a printed circuit board with at least one locating pin formed thereon; and   positioning the printed circuit board on a backboard of a display module by means of the locating pin.   
   
   
       17 . The method as claimed in  claim 16 , wherein positioning the printed circuit board on the backboard of the display module by means of the locating pin comprises:
 Inserting said at least one locating pin into at least one locating hole.   
   
   
       18 . The method as claimed in  claim 16 , further comprising:
 fixing the printed circuit board on the backboard of the display module after positioned.   
   
   
       19 . The method as claimed in  claim 18 , wherein fixing the printed circuit board on the backboard of the display module comprises:
 screwing the printed circuit board on the backboard of the display module.