Lamp and method of producing a lamp

Abstract

A method of producing a lamp, including: mounting light emitting junctions in respective receptacles; mounting the receptacles on a curved support structure so as to form a three-dimensional array; and placing the light emitting junctions in electrical connection with the support structure.

1 - 50 . (canceled) 
   
   
       51 . An LED packaging method, including:
 forming an electrically and thermally conductive receptacle having a substantially planar base and a substantially planar peripheral region;   forming an electrical insulator on the peripheral region;   forming an electrically conductive material on the electrical insulator;   mounting a semiconductor die directly to the base within the receptacle, the die incorporating at least one light emitting diode (LED); and   forming one or more electrical connections between the electrical electrically conductive material and one or more electrical contacts of the die to provide a packaged LED.   
   
   
       52 . The method of  claim 51 , wherein the step of forming the electrically conductive material includes forming first and second electrical contacts on the electrical insulator, and the step of forming the electrical connections includes forming at least one first electrical connection between the first electrical contact and a first electrical contact of the light source, and forming at least one second electrical connection between the second electrical contact and a second electrical contact of the light source. 
   
   
       53 . The method of  claim 52 , including disposing a phosphor over the light source. 
   
   
       54 . The method of  claim 53 , wherein the phosphor is dispersed within an encapsulant. 
   
   
       55 . The method of  claim 51 , including encapsulating the semiconductor die within an encapsulant. 
   
   
       56 . The method of  claim 51 , wherein the step of forming the receptacle includes coating at least an inner surface of the receptacle with an electrically conductive material. 
   
   
       57 . The method of  claim 51 , wherein the step of forming the receptacle includes coating at least an inner surface of the receptacle with an electrically conductive and highly reflective material to enhance the optical performance of the packaged LED. 
   
   
       58 . The method of  claim 57 , wherein the coating material includes silver, aluminium, a silver alloy, or an aluminium alloy. 
   
   
       59 . The method of  claim 51 , wherein the receptacle is formed from copper or a copper alloy. 
   
   
       60 . The method of  claim 51 , wherein the die is mounted to the base of the receptacle using an adhesive. 
   
   
       61 . The method of  claim 60 , wherein the adhesive is electrically and thermally conductive. 
   
   
       62 . The method of  claim 52 , wherein the receptacle includes means to distinguish between electrical contacts disposed on the electrical insulator to enable the electrical polarities of said electrical contacts to be determined. 
   
   
       63 . The method of  claim 62 , wherein said means includes a mark formed on the receptacle after the receptacle is formed. 
   
   
       64 . An LED packaging method, including:
 forming a plurality of packaged LEDs by performing the method of  claim 51 ; and   packaging the plurality of packaged LEDs into a linear strip or two-dimensional sheet for subsequent processing.   
   
   
       65 . An LED packaging method, including:
 forming a plurality of surface mount packaged LEDs by performing the method of  claim 51 ; and   mounting the plurality of surface mount packaged LEDs to a metal cored printed circuit board.   
   
   
       66 . A packaged LED formed by performing the method of  claim 51 . 
   
   
       67 . A surface mount packaged LED formed by performing the method of  claim 51 . 
   
   
       68 . A packaged LED, including:
 an electrically and thermally conductive receptacle having a substantially planar base and a substantially planar peripheral region;   an electrical insulator disposed on the peripheral region;   an electrically conductive material disposed on the electrical insulator;   a semiconductor die mounted directly to the base within the receptacle, the die incorporating at least one light emitting diode (LED); and   one or more electrical connections between the electrical electrically conductive material and one or more electrical contacts of the die.   
   
   
       69 . The packaged LED of  claim 68 , wherein the electrically conductive material provides first and second electrical contacts disposed on the electrical insulator, and the electrical connections include at least one first electrical connection between the first electrical contact and a first electrical contact of the die, and at least one second electrical connection between the second electrical contact and a second electrical contact of the die. 
   
   
       70 . The packaged LED of  claim 68 , including a phosphor disposed over the die. 
   
   
       71 . The packaged LED of  claim 70 , wherein the phosphor is dispersed within an encapsulant disposed over the die. 
   
   
       72 . The packaged LED of  claim 68 , wherein the die is encapsulated within an encapsulant. 
   
   
       73 . The packaged LED of  claim 68 , wherein an inner surface of the receptacle is coated with an electrically conductive material. 
   
   
       74 . The packaged LED of  claim 68 , wherein an inner surface of the receptacle is coated with an electrically conductive and highly reflective material to enhance the optical performance of the packaged LED. 
   
   
       75 . The packaged LED of  claim 74 , wherein the electrically conductive and highly reflective material includes silver, aluminium, a silver alloy, or an aluminium alloy. 
   
   
       76 . The packaged LED of  claim 68 , wherein the receptacle is formed from copper or a copper alloy. 
   
   
       77 . The packaged LED of  claim 68 , wherein the die is mounted to the base of the receptacle using an adhesive. 
   
   
       78 . The packaged LED of  claim 77 , wherein the adhesive is electrically and thermally conductive. 
   
   
       79 . The packaged LED of  claim 68 , wherein the receptacle includes means to distinguish between electrical contacts disposed on the electrical insulator to enable the electrical polarities of said electrical contacts to be determined. 
   
   
       80 . The packaged LED of  claim 68 , wherein the packaged LED is a surface mount packaged LED. 
   
   
       81 . A metal cored printed circuit board having surface mounted thereto a plurality of the surface mount packaged LEDs of  claim 80 .