Metal inks

Abstract

Self-reducing metal inks and systems and methods for producing and using the same are disclosed. In an exemplary embodiment, a method may comprise selecting a metal-organic (MO) precursor, selecting a reducing agent, and dissolving the MO precursor and the reducing agent in an organic solvent to produce a metal ink that remains in a liquid phase at room temperature. Metal inks, including self-reducing and fire-through metal inks, are also disclosed, as are various applications of the metal inks.

1 - 20 . (canceled) 
     
     
         21 . A fire-through metal ink for a solar cell, the metal ink comprising:
 a soluble metal complex;   a soluble organo-metallic reagent;   a solution, the solution containing a particulate metal or metal organic precursor at room temperature, the solution combined with the soluble organo-metallic reagent and the soluble metal complex to produce the metal ink.   
     
     
         22 . The fire-through metal ink of  claim 21 , further comprising dissolving the metal organic precursor and a reducing agent in an organic solvent to produce the fire-through metal ink. 
     
     
         23 . The fire-through metal ink of  claim 21 , wherein the metal ink remains in a liquid phase at room temperature. 
     
     
         24 . The fire-through metal ink of  claim 21 , wherein the metal ink has a ratio of precursor to organic solvent providing viscosity for inkjet printing. 
     
     
         25 . The fire-through metal ink of  claim 24 , wherein the ratio of precursor to organic solvent is in a range of about 1:10 and about 1:1. 
     
     
         26 . The fire-through metal ink of  claim 21 , further comprising a ratio of precursor to organic solvent providing viscosity and wetting properties for inkjet printing, the ratio being approximately within the range of about 1:10 and about 1:1 
     
     
         27 . The fire-through metal ink of  claim 26 , wherein the ratio of precursor to organic solvent is in a range of about 1:10 and about 1:1. 
     
     
         28 . The fire-through metal ink of  claim 26 , further comprising a substantially uncontaminated metal deposit on a substrate. 
     
     
         29 . The fire-through metal ink of  claim 26 , further comprising metal deposits formed at elevated temperatures. 
     
     
         30 . The fire-through metal ink of  claim 29 , further comprising metal deposits selected from the group consisting essentially of: copper (Cu), gold (Au), silver (Ag), lead (Pb), palladium (Pd), platinum (Pt), cobalt (Co), iron (Fe), Tin (Sn), and metal alloys. 
     
     
         31 . A fire-through metal ink comprising lead acetate in ethylene glycol, wherein when deposited on an AR coating  34  the lead acetate is reduced to PbO forming continuous layers and patterns of controlled thickness. 
     
     
         32 . The fire-through metal ink of  claim 31 , wherein the PbO completely etches the AR coating at temperatures as low as about 500 C after only 10 minutes. 
     
     
         33 . The fire-through metal ink of  claim 32 , wherein increasing the temperature increases the etching rate. 
     
     
         34 . The fire-through metal ink of  claim 33 , wherein increasing the temperature to about 750 C for 10 min produces a  1  micrometer deep etch pits. 
     
     
         35 . The fire-through metal ink of  claim 31 , wherein both mixed and single-oxide liquid chemical precursors facilitate a “burn-through” process on solar cell substrates having an AR coating. 
     
     
         36 . The fire-through metal ink of  claim 35 , wherein the mixed-oxide liquid chemical precursors consist essentially of lead (lead acetate, lead formate), boron (boric acid) and silicon (silane). 
     
     
         37 . The fire-through metal ink of  claim 31 , wherein functional components are added to the fire-through metal ink to control chemical and/or physical properties of the fire-through metal ink. 
     
     
         38 . A fire-through metal ink comprising lead acetate in ethylene glycol, wherein when deposited on an AR coating  34  the lead acetate is reduced to a metal oxide forming continuous layers and patterns of controlled thickness. 
     
     
         39 . The fire-through metal ink of  claim 38 , wherein the metal oxide is at least one of the following, PbO, SnO, SnO2 and ZnO.