US2010163291A1PendingUtilityA1

Substrate embedded with passive device

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Assignee: SAMSUNG ELECTRO MECHPriority: Oct 17, 2005Filed: Mar 11, 2010Published: Jul 1, 2010
Est. expiryOct 17, 2025(expired)· nominal 20-yr term from priority
Inventors:Seung Hyun ChoIl Soung YoonWon-Cheol BaeSe-Jong Oh
H05K 2201/0347H05K 3/323H05K 2201/0355H05K 1/188H10W 90/724H10W 72/9415H10W 72/90H10W 70/614H10W 44/601H10D 84/00
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Claims

Abstract

A substrate embedded with a passive device, including a substrate, on which a cavity is formed; a passive device in the cavity, the passive being pre-molded; and a conductive material for adhering the passive device to the cavity, the conductive material being laminated on the cavity.

Claims

exact text as granted — not AI-modified
1 . A substrate embedded with a passive device, comprising:
 a substrate, on which a cavity is formed;   a passive device in the cavity, the passive being pre-molded; and   a conductive material for adhering the passive device to the cavity, the conductive material being laminated on the cavity.   
   
   
       2 . The substrate of  claim 1 , wherein the passive device is selected from the group consisting of a resistance, an inductor and a condenser. 
   
   
       3 . The substrate of  claim 1 , wherein the condenser is a multilayer ceramic condenser. 
   
   
       4 . The substrate of  claim 1 , wherein the conductive material is an anisotropic conductive film or an anisotropic conductive paste. 
   
   
       5 . The substrate of  claim 1 , wherein the material molding the passive device is an epoxy resin.

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