Camera module

Abstract

A camera module having a housing; a lens section mounted in the housing; an IR cut filter mounted in the housing so as to cut infrared rays from the incident light passing through the lens section; and an image sensor module composed of a double-sided flexible printing circuit board (FPCB) in which a window for transmitting the incident light passing through the IR cut filter is formed, an image sensor which is attached on one side of the double-sided FPCB so as to cover the window; and at least one electric part which is attached on the other side of the double-sided FPCB having the image sensor attached thereto, the image sensor module being coupled to the housing.

1 . A camera module comprising:
 a housing;   a lens section mounted in the housing;   an IR cut filter mounted in the housing so as to cut infrared rays from the incident light passing through the lens section; and   an image sensor module composed of a double-sided flexible printing circuit board (FPCB) in which a window for transmitting the incident light passing through the IR cut filter is formed, an image sensor which is attached on one side of the double-sided FPCB so as to cover the window; and at least one electric part which is attached on the other side of the double-sided FPCB having the image sensor attached thereto, the image sensor module being coupled to the housing.   
   
   
       2 . The camera module according to  claim 1 ,
 wherein the electric parts are mounted so as to be positioned between the window and the outer circumference of the image sensor.   
   
   
       3 . The camera module according to  claim 1 ,
 wherein the electric parts includes at least one multilayer ceramic capacitor (MLCC).   
   
   
       4 . The camera module according to  claim 1 ,
 wherein the image sensor has multiple electrode pads formed on the surface thereof which is attached to the one side of the double-sided FPCB, and bumps are formed in the electrode pads.   
   
   
       5 . The camera module according to  claim 4 ,
 wherein the bump is composed of any one of a stud-type bump, a non-electrolytic bump, and an electrolytic bump.