Image sensor module

Abstract

A image sensor module having a double-sided flexible printing circuit board (FPCB) having a window formed; an image sensor attached on one side of the double-sided FPCB so as to cover the window; and at least one electric part attached on the other side of the double-sided FPCB having the image sensor attached thereto.

1 . An image sensor module comprising:
 a double-sided flexible printing circuit board (FPCB) having a window formed;   an image sensor attached on one side of the double-sided FPCB so as to cover the window; and   at least one electric part attached on the other side of the double-sided FPCB having the image sensor attached thereto.   
   
   
       2 . The image sensor module according to  claim 1 ,
 wherein the electric parts are mounted so as to be positioned between the window and the outer circumference of the image sensor.   
   
   
       3 . The image sensor module according to  claim 1 ,
 wherein the electric parts include at least one multilayer ceramic capacitor (MLCC).   
   
   
       4 . The image sensor module according to  claim 1 ,
 wherein the image sensor has multiple electrode pads formed on the surface thereof which is attached to the one side of the double-sided FPCB, and bumps are formed in the electrode pads.   
   
   
       5 . The image sensor module according to  claim 4 ,
 wherein the bump is composed of any one of a stud-type bump, a non-electrolytic bump, and an electrolytic bump.