US2010155653A1PendingUtilityA1

Silver-based powder, method of preparation thereof, and curable silicone composition

Assignee: DOW CORNING TORAY CO LTDPriority: Nov 29, 2002Filed: Feb 26, 2010Published: Jun 24, 2010
Est. expiryNov 29, 2022(expired)· nominal 20-yr term from priority
B22F 1/16C08K 9/04C08K 3/08C08G 77/20C08L 83/04H05K 3/321C08G 77/12C09J 183/04
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Claims

Abstract

A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

Claims

exact text as granted — not AI-modified
1 - 4 . (canceled) 
   
   
       5 . A composition comprising a curable silicone composition and a silver-based powder, wherein the silver-based powder has a surface and comprises a chemical reaction product of an oxidation inhibitor that is a triazole-based compound and the surface. 
   
   
       6 - 7 . (canceled) 
   
   
       8 . The composition of  claim 5 , where the curable silicone composition is curable with a hydrosilylation reaction. 
   
   
       9 . The composition of  claim 8 , where the curable silicone composition comprises:
 (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule;   (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, where component (B) is present in an amount sufficient to provide silicon-bonded hydrogen atoms in an amount of 0.5 to 5 per one alkenyl group of component (A);   (C) 50 to 2,000 parts by weight of the silver-based powder for each 100 parts by weight of component (A); and   (D) a platinum catalyst in an amount required for promoting the hydrosilylation reaction.   
   
   
       10 . The composition of  claim 5  that is further defined as an electroconductive adhesive agent, a heat-radiating adhesive agent, an electroconductive die-bonding agent, a heat-radiating die-bonding agent, an electroconductive paste, a heat-radiating paste, an electromagnetic shielding agent, or raw material for manufacturing an electroconductive sheet, a heat-radiating sheet, or an electromagnetic-wave absorption sheet. 
   
   
       11 . The composition of  claim 5 , wherein the oxidation inhibitor is present in an amount of 0.01 to 2 parts by weight per 100 parts by weight of the silver-based powder. 
   
   
       12 . The composition of  claim 9 , wherein the oxidation inhibitor is present in an amount of 0.01 to 2 parts by weight per 100 parts by weight of the silver-based powder. 
   
   
       13 . A composition as set forth in  claim 9 , wherein the silver-based powder is present in an amount of 300 to 600 parts by weight for each 100 parts by weight of component (A). 
   
   
       14 . A composition comprising:
 a silicone composition curable with a hydrosilylation reaction and comprising;
 (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule, 
 (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, where component (B) is present in an amount sufficient to provide silicon-bonded hydrogen atoms in an amount of 0.5 to 5 per one alkenyl group of component (A), 
 (C) 50 to 2,000 parts by weight of the silver-based powder for each 100 parts by weight of component (A), and 
 (D) a platinum catalyst in an amount required for promoting the hydrosilylation reaction; and 
   a silver-based powder present in an amount of 300 to 600 parts by weight per 100 parts by weight of component (A),   wherein the silver-based powder has a surface and comprises a chemical reaction product of an oxidation inhibitor that is a triazole-based compound and the surface, and   wherein the oxidation inhibitor is present in an amount of 0.01 to 2 parts by weight per 100 parts by weight of the silver-based powder.   
   
   
       15 . The composition of  claim 14  that is further defined as an electroconductive adhesive agent, a heat-radiating adhesive agent, an electroconductive die-bonding agent, a heat-radiating die-bonding agent, an electroconductive paste, a heat-radiating paste, an electromagnetic shielding agent, or raw material for manufacturing an electroconductive sheet, a heat-radiating sheet, or an electromagnetic-wave absorption sheet.

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