Surface treatment method, circuit lines formation method, circuit lines formation apparatus, and printed circuit board formed thereby

Abstract

The present invention relates to a method of surface treatment, a method for forming circuit lines, a printed circuit board formed thereby, and an apparatus for forming circuit lines on a substrate, wherein fine circuit lines are formed simply, rapidly, and economically. The method for forming circuit lines of the present invention comprises: (a) selectively applying a surface treatment solution which includes an alkali metal compound on a base film in accordance with circuit patterns by a discharging method; (b) applying a conductive ink which includes metal nanoparticles in accordance with the surface-treated circuit pattern; and (c) curing the base film on which the conductive ink is applied under a reduction atmosphere lines.

1 . An apparatus for forming circuit lines on a substrate comprising;
 an ink-jet printer head for the surface treatment which discharges a surface treatment solution including an alkali metal compound; and   an ink-jet printer head for the conductive ink which discharges a conductive ink including metal nanoparticles,   wherein said ink-jet printer head for the surface treatment and said ink-jet printer head for the conductive ink may simultaneously discharge the surface treatment solution and the conductive ink, respectively,   
   
   
       2 . The apparatus as claimed in  claim 1 , wherein said ink-jet printer head for the surface treatment and said ink-jet printer head for the conductive ink operate independently in corresponding to different action control signals, and discharge the surface treatment solution and the conductive ink, respectively. 
   
   
       3 . The apparatus as claimed in  claim 1 , wherein a nozzle size of said ink-jet printer head for the surface treatment is smaller than a nozzle size of said ink-jet printer head for the conductive ink. 
   
   
       4 . The apparatus as claimed in  claim 3  wherein a nozzle diameter of said ink-jet printer head for the surface treatment is smaller than a nozzle diameter of said ink-jet printer head for the conductive ink by from 1 to 20 μm. 
   
   
       5 . The apparatus as claimed in  claim 1 , wherein a discharging frequency of said ink-jet printer head for the surface treatment is different from a discharging frequency of said ink-jet printer head for the conductive ink.