Light-Emitting Diode Arrays and Methods of Manufacture

Abstract

A representative LED array includes: a base substrate (BS) and a plurality of light emitting diodes, each of the light emitting diodes comprising a stack of a first contact layer, a semiconductor stack and a second contact layer, the semiconductor stack being on top of the first contact layer, the second contact layer being on top of the semiconductor stack; the plurality of light emitting diodes being arranged in pixel matrix on the base substrate as LEDs of at least three types (R, G, B); the LEDs according to their type (R, G, B) being arranged as at least a first, second and third sub-pixel in the pixel matrix for emission of radiation of a respective specific at least first, second and third color; and interconnection circuitry on the substrate, operative to connect to the light emitting diodes of the array for addressing each of the light emitting diodes.

1 - 20 . (canceled) 
     
     
         21 . A method for manufacturing an LED array, comprising:
 providing a base substrate (BS);   providing on the base substrate a plurality of light emitting diodes, each light emitting diode comprising a stack of a first contact layer, a semiconductor stack and a second contact layer, the semiconductor stack being on top of the first contact layer, the second contact layer being on top of the semiconductor stack;   arranging the plurality of light emitting diodes in a pixel matrix on the base substrate as LEDs of at least three types (R, G, B);   arranging the LEDs according to their type (R, G, B) as at least a first, second and third sub-pixel in the pixel matrix for emission of radiation of a respective specific at least first, second and third color;   providing precursor/adhesion layers on the base substrate, wherein light emitting diodes of at least one type of the at least three types of LEDs are directly on the base substrate, and light emitting diodes of other type(s) of the at least three types of LEDs are arranged on the precursor/adhesion layers respectively;   providing interconnection circuitry on the substrate for connection to the light emitting diodes of the array for addressing each of the light emitting diodes; and   providing an overcoat layer covering the plurality of light emitting diodes and filling gaps between the plurality of light emitting diodes.   
     
     
         22 . Method according to  claim 21 , wherein the base substrate is either a specific substrate for the crystal lattice of at least one type of semiconductor stack to be grown or a substrate with acceptable structural correlation with the crystal lattice of said at least one type of semiconductor stack to be grown. 
     
     
         23 . Method according to  claim 21 , further comprising: attaching the base substrate to a carrier plate to form an assembly of the base substrate and carrier plate. 
     
     
         24 . Method according to  claim 23 , wherein attaching the base substrate on the carrier plate is by means of either a lamination process or a layer deposition process or a layer growth process. 
     
     
         25 . Method according to  claim 21 , wherein the first contact layer is arranged directly on the base substrate (BS). 
     
     
         26 . Method according to  claim 21 , wherein the precursor/adhesion layers are provided between the first contact layer and the base substrate (BS). 
     
     
         27 . Method according to  claim 21 , further comprising: cutting the assembly of base substrate and carrier plate into one or more display modules.