US2010143602A1PendingUtilityA1

Method for coating a substrate

Assignee: HEFT ANDREASPriority: May 29, 2007Filed: Nov 30, 2009Published: Jun 10, 2010
Est. expiryMay 29, 2027(~0.8 yrs left)· nominal 20-yr term from priority
C23C 16/401C03C 2218/153C23C 16/513C03C 17/00
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Claims

Abstract

A method for coating a substrate is provided in that a plasma jet is produced from a working gas, at least one precursor material is fed to the working gas and/or the plasma jet and is reacted in the plasma jet and at least one reaction product of at least one of the precursors is deposited on at least one surface of the substrate and/or on at least one layer arranged on the surface. At least one of the deposited layers improve the optical transmission properties of the substrate.

Claims

exact text as granted — not AI-modified
1 . A method for coating a substrate, the method comprising:
 generating a plasma jet from a working gas;   supplying at least one precursor material to the working gas and/or the plasma jet, the at least one precursor material being reacted in the plasma jet; and   depositing at least one reaction product having at least one precursor material on at least one surface of the substrate and/or on at least one layer arranged on the surface,   wherein at least one of the deposited layers improves an optical transmission of the substrate and/or reduces a reflection,   wherein the substrate at least for a first coating is hot or is heated,   wherein the first coating occurs subsequent to a substrate manufacturing process in which the substrate is formed with the aid of heat, and   wherein the generation of the plasma occurs in a free jet plasma source.   
     
     
         2 . The method according to  claim 1 , wherein the coating of a substrate is made of glass, plastic, glass ceramic, ceramic, or metal. 
     
     
         3 . The method according to  claim 1 , wherein a temperature of the substrate, at least on one substrate surface, is within a range of from 300° C. to 800° C. 
     
     
         4 . The method according to  claim 1 , wherein the depositing of the layer takes place at a pressure, which results from an ambient atmospheric pressure and a flow relationships predominating in the unit. 
     
     
         5 . The method according to  claim 4 , wherein the depositing of the layer takes place at atmospheric pressure. 
     
     
         6 . The method according to  claim 1 , wherein the generation of the plasma occurs via a dielectrically hindered discharge or by microwave excitation. 
     
     
         7 . The method according to  claim 1 , wherein a gaseous precursor is used. 
     
     
         8 . The method according to  claim 1 , wherein, via at least one of the deposited layers, at least one of the properties of the substrate is changed, the properties including scratch resistance, self-healing ability, barrier behavior, reflection behavior, transmission behavior, refractive index, transparency, light scattering, electrical conductivity, antibacterial behavior, friction, adhesion, hydrophilicity, hydrophobicity, oleophobicity, surface tension, surface energy, anticorrosive action, dirt-repellent action, self-cleaning ability, photocatalytic behavior, antistress behavior, wear behavior, chemical resistance, biocidal behavior, biocompatible behavior, electrostatic behavior, electrochromic activity, photochromic activity, and/or gasochromic activity. 
     
     
         9 . The method according to  claim 1 , wherein the deposited layer contains at least one of the components comprising silicon, silver, gold, copper, iron, nickel, cobalt, selenium, tin, aluminum, titanium, zinc, zirconium, tantalum, chromium, manganese, molybdenum, tungsten, bismuth, germanium, niobium, vanadium, gallium, indium, magnesium, calcium, strontium, barium, lithium, lanthanides, carbon, oxygen, nitrogen, sulfur, boron, phosphorus, fluorine, halogens, or hydrogen. 
     
     
         10 . The method according to  claim 1 , wherein an organosilicon and/or organotitanium compound is used as the precursor. 
     
     
         11 . The method according to  claim 1 , wherein air or a gas or vapor is used as the working gas. 
     
     
         12 . The method according to  claim 11 , wherein oxygen, nitrogen, noble gases, hydrogen, carbon dioxide, gaseous hydrocarbons, or a mixture of at least two of the aforementioned working gases is used as the working gas. 
     
     
         13 . The method according to  claim 1 , wherein at least one of the layers is deposited as a gradient layer. 
     
     
         14 . The method according to  claim 1 , wherein a first layer with a barrier effect and then at least one other layer are deposited. 
     
     
         15 . The method according to  claim 3 , wherein a temperature of the substrate at least on one substrate surface is within a range of from room temperature to 800° C., instead of within a range between 300° C. and 800° C.

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